ASUS ROG G733ZS-KH026 RAM upgrade specifications

ASUS G733ZS-KH026 ASUS G733ZS-KH026 ASUS G733ZS-KH026 ASUS G733ZS-KH026 ASUS G733ZS-KH026

ASUS ROG Strix SCAR 17 G733ZS-KH026 laptop features DDR5-SDRAM memory upgrade specifications. The device contains 2x SO-DIMM slots supporting maximum RAM capacity of 64 GB. Compatible memory modules operate at 4800 MHz frequency. Upgrade options accommodate SO-DIMM form factor RAM modules, enabling users to expand memory capacity according to specifications. Maximum supported memory configuration reaches 64 GB total capacity across both slots.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency4800 MHz
Maximum RAM64 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-4800 (PC5-38400)
Bandwidth38.4 GB/s
Laptop Release date22 August 2022

Additional Notes

  • The ASUS ROG G733ZS-KH026 utilizes DDR5 SO-DIMM modules, which are physically incompatible with DDR4 slots due to different notch positioning and voltage requirements.
  • The 4800 MHz frequency represents DDR5's entry-level speed tier, meaning modules rated at 5200 MHz, 5600 MHz, or higher will downclock to match the system's 4800 MHz limitation.
  • The 64 GB maximum capacity constraint requires 32 GB modules in both slots, as exceeding this threshold may prevent POST completion or trigger memory training failures.
  • SO-DIMM form factor installation requires accessing the bottom panel, which typically involves removing multiple screws and potentially voiding warranty seals depending on regional regulations.
  • DDR5's dual-channel architecture operates independently per module through on-die ECC, unlike DDR4's controller-based channel pairing, affecting how memory errors are detected and corrected.
  • The 2-slot configuration eliminates future expansion beyond initial dual-module installation, requiring complete replacement rather than incremental additions when upgrading capacity.
  • Mixing modules with different densities or ranks may force the memory controller to operate in asymmetric mode, reducing bandwidth efficiency despite maintaining dual-channel functionality.
  • DDR5's higher minimum voltage specification of 1.1V compared to DDR4's 1.2V impacts thermal output and power delivery requirements within the laptop's confined cooling system.
  • Non-XMP modules will default to JEDEC standard timings, which at 4800 MHz translates to CL40 latency compared to performance modules offering CL38 or lower at equivalent speeds.
  • The platform's 4800 MHz ceiling means bandwidth tops out at 76.8 GB/s per channel, creating potential bottlenecks for GPU-intensive workloads sharing system memory through integrated graphics switching.