ASUS ROG GL703GS-EE087 RAM upgrade specifications

ASUS GL703GS-EE087 ASUS GL703GS-EE087 ASUS GL703GS-EE087 ASUS GL703GS-EE087 ASUS GL703GS-EE087

The ASUS ROG Strix GL703GS-EE087 laptop features two SO-DIMM memory slots supporting DDR4-SDRAM upgrades at 2666 MHz frequency. Maximum RAM capacity reaches 32 GB total, allowing users to expand the existing memory configuration. Compatible upgrades utilize SO-DIMM form factor modules. RAM specifications indicate support for DDR4 memory technology, enabling enhanced multitasking and performance capabilities through memory expansion.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date18 November 2019

Additional Notes

  • The ASUS ROG GL703GS-EE087 utilizes SO-DIMM modules, which measure 67.6 millimeters in length compared to standard 133.35-millimeter desktop DIMMs, preventing installation of desktop memory modules.
  • DDR4-SDRAM operates at 1.2 volts, while DDR3 variants require 1.5 or 1.35 volts, making older generation modules electrically incompatible regardless of physical slot configuration.
  • The 2666 MHz frequency translates to PC4-21300 bandwidth rating, delivering 21.3 gigabytes per second theoretical throughput per module in single-channel configuration.
  • With only 2 SO-DIMM slots available, achieving the 32 gigabyte maximum capacity requires two 16-gigabyte modules, eliminating incremental upgrade paths beyond the initial configuration.
  • Dual-channel architecture requires matched pairs for optimal memory interleaving, meaning asymmetric configurations such as 8 plus 16 gigabytes will operate with reduced bandwidth on the non-matched portion.
  • Modules rated above 2666 MHz will function but downclock to match the supported frequency, offering no performance benefit despite potential cost premium.
  • The DDR4 specification includes keying notches positioned differently than DDR3, providing physical prevention of incorrect module insertion that could damage the memory controller.
  • CAS latency typically ranges from CL15 to CL19 at this frequency, with lower values reducing memory access delays by 1 to 3 nanoseconds in latency-sensitive operations.
  • Non-ECC unbuffered modules are standard for this configuration, as registered or error-correcting variants require server-grade memory controllers not present in consumer platforms.
  • Temperature ratings for standard SO-DIMMs span 0 to 85 degrees Celsius operational range, though sustained gaming loads may approach thermal throttling thresholds without adequate chassis ventilation.