ASUS ROG GX650RW-LS114W RAM upgrade specifications
ASUS ROG Zephyrus Duo 16 GX650RW-LS114W supports DDR5-SDRAM memory upgrades across 2x SO-DIMM slots. The laptop specifications accommodate a maximum RAM capacity of 64 GB total, with compatible memory operating at 4800 MHz frequency. Upgrade options utilize SO-DIMM form factor modules, providing expandable memory capacity for enhanced multitasking and performance. Specifications indicate dual-slot configuration for memory installation and configuration flexibility.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR5-SDRAM |
| Frequency | 4800 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.1V |
| Number of pins | 262-pin |
| Interface | PC5 |
| PC Speed Rating | PC5-4800 (PC5-38400) |
| Bandwidth | 38.4 GB/s |
| Laptop Release date | 19 March 2022 |
Additional Notes
- The presence of 2 SO-DIMM slots in the ASUS GX650RW-LS114W signifies a dual-channel memory architecture that requires installing modules in pairs to achieve peak memory bandwidth.
- Upgrading to the 64 GB maximum capacity involves replacing both existing modules because the motherboard lacks additional vacant slots for expansion.
- The DDR5-SDRAM standard utilizes on-die Error Correction Code which enhances system stability during high-intensity computational tasks without requiring specialized workstation processors.
- Integrated power management integrated circuits on the memory modules shift voltage regulation responsibilities from the motherboard to the RAM itself, potentially reducing thermal stress on the logic board components.
- Installing memory with frequencies exceeding 4800 MHz will result in the hardware downclocking to the rated bus speed defined by the system firmware limitations.
- Compatibility is restricted to 262-pin small outline modules, ensuring that high-profile desktop memory cannot be physically or electrically interfaced with the system.
- Accessing the memory slots for installation necessitates the removal of the chassis base plate, which requires careful handling of internal ribbon cables often associated with secondary display or cooling assemblies.