ASUS ROG GA401IU-HE094R RAM upgrade specifications
The ASUS ROG Zephyrus G14 GA401IU-HE094R features DDR4-SDRAM memory configuration with one SO-DIMM upgrade slot. The laptop contains soldered on-board memory combined with one expandable slot, supporting maximum RAM capacity of 24 GB at 3200 MHz frequency. Compatible memory modules must meet DDR4-SDRAM specifications for proper upgrade functionality. The single SO-DIMM slot allows users to expand memory beyond the integrated component, providing upgrade flexibility within the stated maximum specifications.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 24 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 10 April 2020 |
Additional Notes
- The presence of 8 GB of non-removable soldered memory limits the potential for future dual-channel bandwidth optimization to the capacity of the fixed chip.
- Adding a module larger than 8 GB into the single expansion slot results in a flex-mode configuration where only the first 16 GB of the ASUS ROG GA401IU-HE094R total memory operates in high-speed dual-channel mode.
- System stability depends on selecting a module that matches the fixed 3200 MHz frequency because the BIOS will downclock the entire system to the lowest common denominator if a slower stick is installed.
- Latency parity is critical for regional memory timing synchronization between the soldered chips and the removable SO-DIMM to prevent boot failures or intermittent crashes.
- The 24 GB maximum capacity constraint indicates that the motherboard firmware is validated to recognize a maximum of 16 GB in the expansion slot combined with the internal base memory.
- Accessing the single expansion slot requires the removal of the bottom chassis panel which may involve bypassing tamper-evident thermal assembly components depending on local regional service policies.
- Upgrading beyond the factory baseline increases the power draw on the memory voltage regulator module which can lead to marginal increases in localized motherboard heat dissipation during heavy workloads.