ASUS ROG GA401QM-HZ011T RAM upgrade specifications

ASUS GA401QM-HZ011T ASUS GA401QM-HZ011T ASUS GA401QM-HZ011T ASUS GA401QM-HZ011T ASUS GA401QM-HZ011T

The ASUS ROG Zephyrus G14 GA401QM-HZ011T features DDR4-SDRAM memory configuration with one SO-DIMM upgrade slot and 8 GB soldered on-board memory. Maximum RAM capacity reaches 24 GB when a 16 GB DDR4-3200 MHz module is installed in the available slot. Compatible memory upgrades support DDR4-SDRAM specifications at 3200 MHz frequency. The single SO-DIMM slot allows for flexible memory expansion to enhance system performance and multitasking capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM24 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date26 November 2020

Additional Notes

  • The ASUS ROG GA401QM-HZ011T features a hybrid memory architecture with one portion soldered directly to the motherboard and one accessible SO-DIMM slot, preventing complete memory replacement.
  • The 24 GB maximum capacity indicates 8 GB of permanently soldered RAM, allowing only a single 16 GB SO-DIMM module addition to reach the system ceiling.
  • Memory operates in dual-channel mode only when the SO-DIMM module matches or exceeds the soldered capacity, with any excess operating in slower single-channel mode.
  • The 3200 MHz specification requires DDR4 modules rated at PC4-25600 to maintain native speed without downclocking.
  • Installing a module with different timing specifications than the soldered memory may force both to operate at the slower timings, potentially reducing overall performance.
  • The single SO-DIMM configuration limits future upgrade flexibility, as reaching maximum capacity eliminates further expansion options without module replacement.
  • Accessing the SO-DIMM slot typically requires bottom panel removal, which may void warranty seals depending on regional service policies.
  • Mixing memory from different manufacturers between the soldered and socketed portions can introduce stability issues despite meeting speed specifications.
  • The on-board memory cannot be removed or replaced if it fails, requiring motherboard-level service for permanent memory failures.
  • Asymmetric memory configurations created by adding a 16 GB module to 8 GB soldered RAM may trigger Flex Mode, where only matching portions run in dual-channel.