ASUS ROG GA401QM-K2039 RAM upgrade specifications
The ASUS ROG Zephyrus G14 GA401QM-K2039 laptop features DDR4-SDRAM memory upgrade specifications with one SO-DIMM slot for expansion. The system supports maximum RAM capacity of 24 GB, combining on-board memory with a single upgradeable slot. Compatible DDR4 modules operate at 3200 MHz frequency. Upgrade slots accommodate standard SO-DIMM form factor memory, enabling users to expand the laptop's total memory specifications beyond the factory configuration.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 24 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 14 July 2021 |
Additional Notes
- The ASUS ROG GA401QM-K2039 features a hybrid memory architecture with soldered RAM combined with an expansion slot, meaning a portion of the total memory capacity cannot be removed or replaced.
- The 24 GB maximum capacity indicates 8 GB soldered onboard paired with a single 16 GB SO-DIMM module limit, creating an asymmetric dual-channel configuration that may impact memory interleaving efficiency.
- Upgrading beyond the factory configuration requires matching the 3200 MHz specification to avoid frequency downclocking, as the memory controller will default to the lowest common speed among installed modules.
- The single SO-DIMM slot limitation prevents traditional symmetric dual-channel upgrades, restricting flexibility in memory expansion compared to dual-slot implementations.
- DDR4-3200 modules must operate at JEDEC standard timings or support automatic SPD profile adjustment to ensure compatibility with the soldered memory subsystem.
- Physical access to the SO-DIMM slot typically requires bottom panel removal, which may involve breaking warranty seals depending on regional service policies.
- The onboard memory component shares thermal characteristics with the motherboard substrate, while the SO-DIMM module relies on ambient case airflow for heat dissipation during sustained workloads.
- Memory capacity asymmetry between soldered and socketed components will result in a portion of RAM operating in single-channel mode once the smaller capacity threshold is exceeded during memory allocation.
- Voltage specifications must align with DDR4 standard (1.2V) to prevent compatibility issues between the fixed onboard module and user-installed SO-DIMM.
- The SO-DIMM form factor restricts module height to 30mm, eliminating compatibility concerns related to heatspreader clearance common in desktop DIMM installations.