ASUS ROG GA402RJ-L4054W RAM upgrade specifications

ASUS GA402RJ-L4054W ASUS GA402RJ-L4054W ASUS GA402RJ-L4054W ASUS GA402RJ-L4054W ASUS GA402RJ-L4054W

The ASUS ROG Zephyrus G14 GA402RJ-L4054W features DDR5-SDRAM memory with a single SO-DIMM upgrade slot. Maximum RAM capacity reaches 24 GB through compatible upgrades operating at 3200 MHz frequency. Memory configuration includes on-board memory paired with one replaceable SO-DIMM slot, enabling users to expand the laptop's total memory capacity. Specifications demonstrate support for DDR5 technology, providing enhanced performance characteristics compared to previous generation DDR4 standards.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR5-SDRAM
Frequency3200 MHz
Maximum RAM24 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-3200 (PC5-25600)
Bandwidth25.6 GB/s
Laptop Release date28 April 2022

Additional Notes

  • The hardware architecture of the ASUS ROG Zephyrus GA402RJ-L4054W utilizes a non-symmetric memory configuration where a fixed portion of capacity is permanently soldered to the mainboard.
  • Adding a high capacity module to the single available expansion slot results in a flex mode memory configuration where only the matched portion of the capacity operates in a quad-channel equivalent state.
  • The presence of on-board memory means a complete memory failure on the integrated chip requires a full motherboard replacement rather than a simple module swap.
  • Dual-channel performance benefits are restricted to the capacity of the smaller integrated chip and an identical amount of the expansion module.
  • Latency and timing synchronization will default to the highest common denominator between the fixed internal chips and the user-installed SO-DIMM.
  • Total system memory throughput is capped by the soldered chip specifications regardless of whether a higher frequency module is placed in the expansion slot.
  • The 24 GB maximum threshold indicates the motherboard firmware expects an 8 GB internal chip paired with a 16 GB expansion module.
  • Thermal management during heavy workloads is impacted by the proximity of the soldered memory chips to the central processing unit.