ASUS ROG GA402RJ-L4054W RAM upgrade specifications
The ASUS ROG Zephyrus G14 GA402RJ-L4054W features DDR5-SDRAM memory with a single SO-DIMM upgrade slot. Maximum RAM capacity reaches 24 GB through compatible upgrades operating at 3200 MHz frequency. Memory configuration includes on-board memory paired with one replaceable SO-DIMM slot, enabling users to expand the laptop's total memory capacity. Specifications demonstrate support for DDR5 technology, providing enhanced performance characteristics compared to previous generation DDR4 standards.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR5-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 24 GB |
| Voltage | 1.1V |
| Number of pins | 262-pin |
| Interface | PC5 |
| PC Speed Rating | PC5-3200 (PC5-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 28 April 2022 |
Additional Notes
- The hardware architecture of the ASUS ROG Zephyrus GA402RJ-L4054W utilizes a non-symmetric memory configuration where a fixed portion of capacity is permanently soldered to the mainboard.
- Adding a high capacity module to the single available expansion slot results in a flex mode memory configuration where only the matched portion of the capacity operates in a quad-channel equivalent state.
- The presence of on-board memory means a complete memory failure on the integrated chip requires a full motherboard replacement rather than a simple module swap.
- Dual-channel performance benefits are restricted to the capacity of the smaller integrated chip and an identical amount of the expansion module.
- Latency and timing synchronization will default to the highest common denominator between the fixed internal chips and the user-installed SO-DIMM.
- Total system memory throughput is capped by the soldered chip specifications regardless of whether a higher frequency module is placed in the expansion slot.
- The 24 GB maximum threshold indicates the motherboard firmware expects an 8 GB internal chip paired with a 16 GB expansion module.
- Thermal management during heavy workloads is impacted by the proximity of the soldered memory chips to the central processing unit.