ASUS TUF Dash FX516PC-HN095T RAM upgrade specifications
ASUS TUF Dash F15 FX516PC-HN095T laptop supports DDR4-SDRAM memory upgrade specifications. The system contains one SO-DIMM slot for additional memory installation. Maximum RAM capacity reaches 32 GB through compatible DDR4 modules operating at 3200 MHz frequency. Memory configuration includes on-board memory combined with SO-DIMM slot expansion capability. Upgrade specifications ensure compatibility with DDR4-SDRAM standard modules for enhanced performance and multitasking capacity.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 20 October 2021 |
Additional Notes
- The presence of a single SO-DIMM slot alongside on-board memory creates an asymmetrical dual-channel configuration if the capacities do not match.
- Total memory bandwidth remains limited to the speed of the integrated chip even if a faster module is installed in the expansion slot.
- Future capacity increases for the ASUS TUF Dash FX516PC-HN095T require the complete removal and replacement of the existing module rather than adding a second one.
- Partial memory functionality remains available via the soldered component if the removable module fails or is removed for troubleshooting.
- Physical clearance within the chassis restricts compatibility to standard height SO-DIMM modules and excludes those with integrated heat spreaders.
- The hardware architecture likely utilizes a 4 or 8 GB soldered base, meaning a 24 or 28 GB capacity is necessary to reach the maximum supported limit.
- High-latency modules will force the system to downclock to the slowest common timing profile between the soldered and removable memory.
- Internal access for hardware modification involves removing the bottom panel, which exposes sensitive logic board components to electrostatic discharge risks.