ASUS TUF Dash FX516PR-HN064T RAM upgrade specifications

ASUS FX516PR-HN064T ASUS FX516PR-HN064T ASUS FX516PR-HN064T ASUS FX516PR-HN064T ASUS FX516PR-HN064T

ASUS TUF Dash F15 series model FX516PR-HN064T supports DDR4-SDRAM memory upgrades. The laptop contains one SO-DIMM slot available for expansion, with maximum RAM capacity of 32 GB. Memory specifications include 3200 MHz frequency. Compatible upgrade modules must match DDR4-SDRAM type and SO-DIMM form factor. The device features on-board memory combined with the single SO-DIMM slot for total memory capacity expansion.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date24 February 2021

Additional Notes

  • The ASUS TUF Dash FX516PR-HN064T features a hybrid memory architecture with one slot soldered directly to the motherboard, limiting expansion to a single accessible SO-DIMM slot rather than the dual-slot configuration found in many gaming laptops.
  • The presence of on-board memory means that one memory module cannot be removed or replaced, restricting user control over dual-channel configuration and making it impossible to replace both modules with a matched pair.
  • Achieving the 32 GB maximum capacity requires determining the capacity of the soldered memory first, as the accessible slot must accommodate the remaining amount to reach the system limit.
  • The 3200 MHz specification represents the supported JEDEC standard frequency, though actual performance depends on whether both the on-board and SO-DIMM modules operate in dual-channel mode, which requires matching clock speeds between both components.
  • Installing a SO-DIMM module with a different frequency than the soldered memory will force both modules to operate at the lower of the two speeds, potentially underutilizing a faster aftermarket module.
  • The single-slot design prevents future memory upgrades beyond the initial expansion, as replacing the accessible module remains the only option once the maximum capacity is installed.
  • Dual-channel bandwidth relies on both memory components being active simultaneously, meaning a configuration mismatch between the soldered module and the SO-DIMM slot could result in asymmetric channel operation or reduced bandwidth.
  • The on-board memory component is not user-serviceable under standard warranty terms, meaning any failure of the soldered module would require motherboard-level service rather than simple module replacement.
  • DDR4 SO-DIMM modules must comply with JEDEC voltage specifications of 1.2V, as higher-voltage modules designed for overclocking may not initialize properly or could void warranty coverage.
  • The memory controller's maximum capacity support of 32 GB establishes a hard ceiling regardless of module availability, preventing use of higher-density modules that may become available in the future.