ASUS TUF Dash TUF516PE-HN044T RAM upgrade specifications

ASUS TUF516PE-HN044T ASUS TUF516PE-HN044T ASUS TUF516PE-HN044T ASUS TUF516PE-HN044T ASUS TUF516PE-HN044T

The ASUS TUF Dash F15 series model TUF516PE-HN044T supports DDR4-SDRAM memory upgrades with a maximum capacity of 32 GB. The laptop features one SO-DIMM slot available for expansion, compatible with DDR4 modules operating at 3200 MHz frequency. Memory configuration combines on-board integrated RAM with the single upgradeable SO-DIMM slot, allowing users to expand total system memory up to the specified maximum capacity. Specifications define upgrade compatibility and RAM slot availability for this gaming laptop model.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date10 January 2022

Additional Notes

  • The hardware architecture of the ASUS TUF Dash TUF516PE-HN044T utilizes a hybrid memory configuration where a portion of the system memory is permanently soldered to the motherboard.
  • Dual channel performance benefits remain contingent on matching the capacity of the single expansion slot with the existing soldered module.
  • Physical memory expansion is limited to 1 available SO DIMM slot which necessitates the removal of the existing module for any capacity increase.
  • The system total capacity is restricted by the hardwired internal module combined with the density limits of the single expansion port.
  • Data transfer rates are capped at the frequency of the slowest module even if a higher speed replacement is installed in the expansion slot.
  • Synchronous operation between the fixed and removable memory modules depends on choosing components that support identical JEDEC timing profiles at 3200 MHz.
  • Thermal management remains a factor during installation as the expansion slot is positioned in close proximity to the primary logic board components and heat pipes.
  • Upgrading the removable module does not void the standard manufacturer warranty provided no physical damage occurs to the internal soldered components during the process.