ASUS TUF Gaming FA506ICB-HN114W RAM upgrade specifications

ASUS FA506ICB-HN114W ASUS FA506ICB-HN114W ASUS FA506ICB-HN114W ASUS FA506ICB-HN114W ASUS FA506ICB-HN114W

ASUS TUF Gaming A15 FA506ICB-HN114W specifications indicate DDR4-SDRAM memory configuration with 2x SO-DIMM slots supporting maximum capacity of 32 GB total RAM. Compatible memory modules operate at 3200 MHz frequency with SO-DIMM form factor. Upgrade specifications enable replacement or expansion of existing memory modules up to specified maximum capacity for enhanced system performance and multitasking capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s

Additional Notes

  • The dual-channel architecture requires installing two matching memory modules to reach peak memory bandwidth and prevent CPU performance bottlenecks during intensive tasks.
  • The use of SO-DIMM slots implies that the factory memory is not soldered to the motherboard, allowing for the complete replacement of both original sticks to reach the 32 GB ceiling.
  • Upgrading the ASUS TUF Gaming FA506ICB-HN114W necessitates a Phillips head screwdriver and a plastic prying tool for bottom panel removal, which typically does not void the hardware warranty if no physical damage occurs during the process.
  • Installing modules with a frequency higher than 3200 MHz will result in the system down-clocking the hardware to the maximum supported speed of the integrated memory controller.
  • The 32 GB capacity limit indicates the motherboard firmware or processor architecture cannot address the higher density found in 32 GB single-stick modules.
  • Latency parity between the two slots is essential because the system will automatically default to the timings of the slowest installed module.
  • The physical height of standard DDR4 SO-DIMM modules ensures compatibility with the internal chassis clearance, but modules with thick integrated heat spreaders may obstruct the bottom cover.