ASUS TUF Gaming FA506ICB-HN114W RAM upgrade specifications
ASUS TUF Gaming A15 FA506ICB-HN114W specifications indicate DDR4-SDRAM memory configuration with 2x SO-DIMM slots supporting maximum capacity of 32 GB total RAM. Compatible memory modules operate at 3200 MHz frequency with SO-DIMM form factor. Upgrade specifications enable replacement or expansion of existing memory modules up to specified maximum capacity for enhanced system performance and multitasking capabilities.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
Additional Notes
- The dual-channel architecture requires installing two matching memory modules to reach peak memory bandwidth and prevent CPU performance bottlenecks during intensive tasks.
- The use of SO-DIMM slots implies that the factory memory is not soldered to the motherboard, allowing for the complete replacement of both original sticks to reach the 32 GB ceiling.
- Upgrading the ASUS TUF Gaming FA506ICB-HN114W necessitates a Phillips head screwdriver and a plastic prying tool for bottom panel removal, which typically does not void the hardware warranty if no physical damage occurs during the process.
- Installing modules with a frequency higher than 3200 MHz will result in the system down-clocking the hardware to the maximum supported speed of the integrated memory controller.
- The 32 GB capacity limit indicates the motherboard firmware or processor architecture cannot address the higher density found in 32 GB single-stick modules.
- Latency parity between the two slots is essential because the system will automatically default to the timings of the slowest installed module.
- The physical height of standard DDR4 SO-DIMM modules ensures compatibility with the internal chassis clearance, but modules with thick integrated heat spreaders may obstruct the bottom cover.