ASUS TUF Gaming FX707ZR-HX002W RAM upgrade specifications

ASUS FX707ZR-HX002W ASUS FX707ZR-HX002W ASUS FX707ZR-HX002W ASUS FX707ZR-HX002W ASUS FX707ZR-HX002W

ASUS TUF Gaming FX707ZR-HX002W laptop memory upgrade specifications indicate DDR5-SDRAM compatible RAM with two SO-DIMM slots. The upgrade capacity reaches maximum 32 GB total memory. Memory specifications support DDR5-SDRAM frequency of 4800 MHz. Compatible RAM upgrades utilize SO-DIMM form factor modules. F17 series FX707ZR-HX002W model accommodates DDR5 memory technology for enhanced system performance and multitasking capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency4800 MHz
Maximum RAM32 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-4800 (PC5-38400)
Bandwidth38.4 GB/s
Laptop Release date21 January 2022

Additional Notes

  • Dual channel architecture requires matching module pairs to utilize the full memory controller bandwidth provided by the DDR5 interface.
  • The presence of 2 physical SO-DIMM slots allows for the total removal of factory modules to bypass initial capacity limitations during hardware refreshes.
  • The ASUS TUF Gaming FX707ZR-HX002W utilizes a 4800 MHz base frequency which indicates that higher clocked modules will downclock to align with the system firmware constraints.
  • Upgrading to the 32 GB threshold provides the necessary overhead for memory intensive tasks like 4K video editing or complex virtual machine hosting which exceed standard gaming requirements.
  • DDR5 modules feature on-die ECC and integrated power management circuits which reduce the voltage regulation workload on the motherboard compared to older memory generations.
  • Internal component access for memory replacement entails removing the bottom chassis panel which may involve various screw lengths requiring specific torque management to avoid casing stress.
  • Latency performance depends on the CAS timing of the selected 4800 MHz modules since the system BIOS typically lacks manual timing adjustment features found in overclocking tiers.
  • Thermal dissipation for high density DDR5 sticks relies on the internal airflow design as these modules lack heat spreaders in the standard SO-DIMM form factor.