ASUS Vivobook X412FA-EB719T RAM upgrade specifications

ASUS X412FA-EB719T ASUS X412FA-EB719T ASUS X412FA-EB719T ASUS X412FA-EB719T ASUS X412FA-EB719T

ASUS Vivobook 14 Series X412FA-EB719T laptop memory specifications support DDR4-SDRAM upgrade configuration. System includes one SO-DIMM slot for RAM expansion, with maximum compatible capacity of 12 GB total memory. Memory operates at 2400 MHz frequency. Upgrade slots accommodate standard SO-DIMM form factor modules. Memory configuration combines on-board integrated memory with one expandable SO-DIMM slot for enhanced system performance specifications.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM12 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date14 May 2020

Additional Notes

  • The presence of a single expansion slot in the ASUS Vivobook X412FA-EB719T necessitates the removal of the existing module to facilitate any memory increase.
  • Dual channel performance remains restricted to the capacity of the soldered memory chips because any capacity exceeding the on board amount will operate in single channel asynchronous mode.
  • The fixed on board memory creates a hardware floor that cannot be bypassed or disabled if the soldered chips fail outside of the warranty period.
  • Total system memory throughput remains limited to the 2400 MHz frequency even if a higher speed 3200 MHz module is installed as the system will downclock the faster component to maintain stability.
  • Latency disparities between the soldered memory and an aftermarket SO-DIMM may cause the motherboard to default to the slowest common denominator for timing parameters.
  • Physical installation is limited to standard 260 pin modules whereas high density non binary sticks are likely incompatible with the 12 GB addressable ceiling of the internal controller.
  • Airflow around the expansion slot is critical during sustained workloads because the proximity of the soldered memory and the SO-DIMM slot creates a localized heat zone on the motherboard PCB.