ASUS Vivobook X512FA-BQ460T RAM upgrade specifications

ASUS X512FA-BQ460T ASUS X512FA-BQ460T ASUS X512FA-BQ460T ASUS X512FA-BQ460T ASUS X512FA-BQ460T

ASUS Vivobook 15 Series X512FA-BQ460T laptop supports DDR4-SDRAM memory upgrade with one SO-DIMM slot available for expansion. Maximum RAM capacity reaches 12 GB total, combining on-board memory with the upgradeable SO-DIMM module. Memory operates at 2400 MHz frequency. Specifications indicate compatible memory modules must match DDR4-SDRAM standard and SO-DIMM form factor for proper installation in the single upgrade slot.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM12 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date27 January 2020

Additional Notes

  • The presence of a single expansion slot in the ASUS Vivobook X512FA-BQ460T creates a permanent hardware limitation where the total system memory capacity relies on the sum of a fixed motherboard component and one removable module.
  • Asynchronous dual channel mode occurs if the user installs a secondary module with a capacity exceeding the soldered memory, resulting in optimal performance for the first portion of RAM and single channel speeds for the remainder.
  • The integrated memory is non-replaceable, meaning a failure of the soldered chips necessitates a full motherboard replacement rather than a simple component swap.
  • Installing a high frequency module will result in an automatic downclock to 2400 MHz to maintain signal synchronization with the fixed onboard memory.
  • Performance scaling is restricted by the low total limit of 12 GB, which acts as a bottleneck for heavy virtualization or professional video editing workflows despite the DDR4 architecture.
  • Physical upgrades require complete removal of the lower chassis assembly, and the tight internal layout demands a low profile SO-DIMM to ensure proper clearance during reassembly.