ASUS Vivobook X512UA-EJ331T RAM upgrade specifications
The ASUS Vivobook 15 Series X512UA-EJ331T features DDR4-SDRAM memory specifications compatible with upgrade configurations. The laptop contains one SO-DIMM slot for RAM expansion, with on-board memory already integrated. Maximum memory capacity reaches 12 GB total. The memory operates at 2400 MHz frequency. Specifications indicate the upgrade slot accommodates standard SO-DIMM form factor modules. Compatible RAM upgrades must meet DDR4-SDRAM standards and frequency requirements for proper functionality with the X512UA-EJ331T model.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2400 MHz |
| Maximum RAM | 12 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2400 (PC4-19200) |
| Bandwidth | 19.2 GB/s |
| Laptop Release date | 24 October 2019 |
Additional Notes
- The presence of on board memory indicates that 4 GB of the total capacity is non removable and permanently soldered to the motherboard.
- Upgrading the **ASUS Vivobook X512UA-EJ331T** requires a single 8 GB module to reach the maximum system ceiling because the integrated memory occupies the first channel.
- Operating the system with a single expansion slot limits the memory architecture to an asymmetrical dual channel configuration which may impact integrated graphics performance compared to symmetrical setups.
- Installing a module with a frequency higher than 2400 MHz will result in automatic downclocking to match the speed of the soldered chips and the processor bus.
- The internal hardware layout requires the removal of the entire base panel to access the SO-DIMM socket because there is no dedicated maintenance hatch for quick swapping.
- Memory latency will be determined by the slowest common denominator between the fixed on board chips and the user installed module.
- Physical clearance within the thin chassis necessitates the use of standard height SO-DIMM modules as tall heat spreaders will prevent the bottom case from closing properly.