ASUS Vivobook X512UA-EJ331T RAM upgrade specifications

ASUS X512UA-EJ331T ASUS X512UA-EJ331T ASUS X512UA-EJ331T ASUS X512UA-EJ331T ASUS X512UA-EJ331T

The ASUS Vivobook 15 Series X512UA-EJ331T features DDR4-SDRAM memory specifications compatible with upgrade configurations. The laptop contains one SO-DIMM slot for RAM expansion, with on-board memory already integrated. Maximum memory capacity reaches 12 GB total. The memory operates at 2400 MHz frequency. Specifications indicate the upgrade slot accommodates standard SO-DIMM form factor modules. Compatible RAM upgrades must meet DDR4-SDRAM standards and frequency requirements for proper functionality with the X512UA-EJ331T model.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM12 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date24 October 2019

Additional Notes

  • The presence of on board memory indicates that 4 GB of the total capacity is non removable and permanently soldered to the motherboard.
  • Upgrading the **ASUS Vivobook X512UA-EJ331T** requires a single 8 GB module to reach the maximum system ceiling because the integrated memory occupies the first channel.
  • Operating the system with a single expansion slot limits the memory architecture to an asymmetrical dual channel configuration which may impact integrated graphics performance compared to symmetrical setups.
  • Installing a module with a frequency higher than 2400 MHz will result in automatic downclocking to match the speed of the soldered chips and the processor bus.
  • The internal hardware layout requires the removal of the entire base panel to access the SO-DIMM socket because there is no dedicated maintenance hatch for quick swapping.
  • Memory latency will be determined by the slowest common denominator between the fixed on board chips and the user installed module.
  • Physical clearance within the thin chassis necessitates the use of standard height SO-DIMM modules as tall heat spreaders will prevent the bottom case from closing properly.