FUJITSU LIFEBOOK E556 RAM upgrade specifications

FUJITSU E556 FUJITSU E556 FUJITSU E556 FUJITSU E556

The Fujitsu Lifebook E556 laptop features two SO-DIMM slots for memory upgrades. Compatible DDR4-SDRAM modules operate at 2133 MHz frequency. The maximum RAM capacity supported is 32 GB total. Users can upgrade the memory by installing compatible DDR4 SO-DIMM modules in the available slots. Specifications indicate the E556 model supports standard DDR4 memory upgrades for enhanced system performance and multitasking capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date23 August 2017

Additional Notes

  • DDR4-2133 represents first-generation DDR4 specifications, limiting maximum theoretical bandwidth to 17.06 GB/s per module in dual-channel configuration.
  • The 32 GB maximum capacity constraint requires 16 GB modules in both slots, preventing asymmetric configurations if maximum memory is targeted.
  • SO-DIMM form factor restricts compatibility to laptop-specific modules, excluding standard desktop DIMM modules regardless of electrical compatibility.
  • Two-slot configuration means memory expansion requires replacing existing modules rather than simple addition when both slots are occupied.
  • 2133 MHz frequency specification may reject higher-speed modules that lack JEDEC-compliant SPD profiles for automatic downclocking to 2133 MHz.
  • DDR4 voltage requirement of 1.2V differs from DDR3/DDR3L standards, creating absolute incompatibility with previous-generation modules despite physical slot similarities.
  • Dual-channel architecture requires matched module pairs for optimal performance, as mismatched capacities will force single-channel operation on the excess capacity.
  • System chipset limitations enforce the 32 GB ceiling independent of module availability, meaning 32 GB modules cannot be utilized even if physically compatible.
  • Non-ECC unbuffered modules are implied for consumer laptop architecture, making registered or ECC variants incompatible despite matching SO-DIMM form factor.
  • Module rank configuration affects compatibility, as some systems reject dual-rank 16 GB modules while accepting single-rank alternatives at the same capacity.