FUJITSU LIFEBOOK E558 RAM upgrade specifications

FUJITSU E558 FUJITSU E558 FUJITSU E558 FUJITSU E558 FUJITSU E558

The Fujitsu Lifebook E series E558 laptop features DDR4-SDRAM memory upgrade specifications. The system includes 2x SO-DIMM slots for RAM expansion, supporting a maximum capacity of 32 GB total memory. Compatible memory modules operate at 2400 MHz frequency and utilize the SO-DIMM form factor. These specifications define the upgrade parameters and memory configuration capabilities for the E558 model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date19 December 2017

Additional Notes

  • The 2400 MHz frequency limit prevents faster DDR4 modules (2666 MHz, 3200 MHz) from running at their rated speeds, forcing them to downclock to match the system's maximum supported frequency.
  • SO-DIMM form factor restricts this machine to laptop-specific memory modules, excluding standard desktop DIMM modules which are physically incompatible due to different pin counts and physical dimensions.
  • The 32 GB maximum capacity constraint means single 32 GB modules will not function, limiting configurations to either 2x16 GB or lower-density pairings.
  • DDR4-SDRAM specification makes DDR3, DDR3L, and DDR5 modules electrically incompatible regardless of physical form factor due to different operating voltages and signaling protocols.
  • Systems with 2 memory slots require full slot population to achieve maximum capacity, eliminating future expansion headroom once 32 GB is installed.
  • Mixing modules with different speeds will force all installed memory to operate at the frequency of the slowest module, creating a performance bottleneck.
  • Non-matching module capacities or ranks may prevent dual-channel operation, reducing memory bandwidth to single-channel performance levels.
  • The SO-DIMM slot location in laptop chassis typically requires partial or complete disassembly, with potential warranty implications if manufacturer seals are broken during access.
  • ECC SO-DIMM modules are typically incompatible with consumer-grade laptop chipsets unless explicitly specified in official documentation.
  • Voltage variants of DDR4 (1.2V standard vs. low-voltage) must match motherboard specifications to prevent boot failures or system instability.