FUJITSU LIFEBOOK T726 RAM upgrade specifications
FUJITSU LIFEBOOK T Series Model T726 supports DDR4-SDRAM memory upgrades with maximum RAM capacity of 20 GB. Laptop contains 1x SO-DIMM slot for memory expansion, compatible with 2133 MHz frequency specifications. Memory configuration utilizes on-board and SO-DIMM form factor. Upgrade options available to maximize system RAM capacity within compatible specifications.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2133 MHz |
| Maximum RAM | 20 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2133 (PC4-17064) |
| Bandwidth | 17.1 GB/s |
| Laptop Release date | 02 October 2016 |
Additional Notes
- The 20 GB maximum capacity indicates 16 GB soldered to the motherboard with 1 SO-DIMM slot available for a 4 GB module, making full capacity achievable only with this exact configuration.
- DDR4-2133 MHz represents the lower end of DDR4 performance spectrum, constraining upgrade options to matched 2133 MHz modules to prevent performance degradation or compatibility failures.
- Single SO-DIMM slot design eliminates redundancy; any module failure or incompatibility blocks memory expansion entirely until the slot is repaired or replaced.
- SO-DIMM form factor requires laptop-specific modules rather than desktop DDR4, limiting sourcing flexibility and typically resulting in higher per-gigabyte costs than standard DIMM alternatives.
- The soldered 16 GB on-board component cannot be replaced or upgraded independently, locking the base memory configuration for the device lifespan.
- Adding a 4 GB SO-DIMM module creates an asymmetrical memory configuration (16 GB + 4 GB), which may result in single-channel operation on the 4 GB portion depending on controller architecture, potentially reducing throughput on that segment.
- Warranty protection for memory upgrades depends on whether the manufacturer uses adhesive or mechanical retention in the SO-DIMM slot; force applied during module insertion risks triggering damage claims outside coverage scope.