HP Elitebook 850 G4 RAM upgrade specifications
The HP Elitebook 850 G4 laptop features two SO-DIMM memory slots supporting DDR4-SDRAM modules at 2133 MHz frequency. The upgrade specifications indicate a maximum RAM capacity of 32 GB for this model. Compatible memory modules must match the SO-DIMM form factor and DDR4-SDRAM specifications. The dual-slot configuration allows for flexible memory expansion options to meet performance requirements. Current memory capacity can be replaced or supplemented with additional DDR4 modules up to the maximum supported capacity of 32 GB total.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2133 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2133 (PC4-17064) |
| Bandwidth | 17.1 GB/s |
| Laptop Release date | 22 September 2017 |
Additional Notes
- Dual channel architecture requires matching memory module densities to achieve peak memory bandwidth efficiency.
- Installing 2400 MHz or 3200 MHz modules results in automatic downclocking to the processor bus speed limit.
- The 32 GB ceiling necessitates the use of 16 GB high density modules per slot due to chipset addressing limitations.
- Compatibility is restricted to non ECC unbuffered memory modules as the system lacks workstation class error correction support.
- Serviceable access to both slots facilitates a full memory replacement without motherboard removal.
- Mixing modules with different CAS latencies forces the system to operate at the timings of the slower component.
- Physical clearance within the chassis is optimized for standard height SO DIMM modules lacking integrated heat spreaders.
- The integrated graphics system shares the system RAM pool which reduces total available memory for operating system tasks.
- Upgrading from a single module to a dual module configuration provides a significant performance boost for memory intensive applications through increased bus width.