HP Pavilion 17-g115ng RAM upgrade specifications

HP 17-g115ng HP 17-g115ng HP 17-g115ng HP 17-g115ng HP 17-g115ng

The HP Pavilion 17-g115ng laptop contains two SO-DIMM memory slots supporting DDR3-SDRAM modules operating at 1600 MHz frequency. The notebook accommodates a maximum RAM capacity of 16 GB total, with compatible upgrades available in standard SO-DIMM form factor. Current memory specifications and upgrade options allow for expansion within the defined slot and capacity constraints of the model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR3-SDRAM
Frequency1600 MHz
Maximum RAM16 GB
Voltage1.5V
Number of pins204-pin
InterfacePC3
PC Speed RatingPC3-1600 (PC3-12800)
Bandwidth12.8 GB/s
Laptop Release date07 October 2015

Additional Notes

  • DDR3L modules at 1.35V may offer better compatibility and lower heat output than standard 1.5V DDR3 modules in this platform.
  • The chipset architecture limits total addressable memory to 16 GB regardless of individual module capacity, meaning 2x 16 GB configuration will not yield 32 GB.
  • Memory speed is locked at 1600 MHz (PC3-12800) by the memory controller, so faster rated modules will downclock automatically without performance gain.
  • Dual-channel operation requires matched module capacities in both slots, otherwise the system defaults to single-channel mode with reduced bandwidth.
  • Single-rank modules may provide better stability in 2x 8 GB configurations compared to dual-rank equivalents on this platform generation.
  • Non-ECC unbuffered modules are required, as registered or ECC memory types are incompatible with consumer mobile chipsets.
  • CAS latency differences between CL9, CL10, and CL11 modules at 1600 MHz produce negligible real-world performance variation in typical workloads.
  • Accessing memory slots requires full bottom panel removal on this chassis design, complicating field upgrades compared to dedicated access doors.
  • Mixed-capacity configurations such as 4 GB plus 8 GB will function but sacrifice dual-channel bandwidth on a portion of the total capacity.
  • The 204-pin SO-DIMM physical standard differs from desktop 240-pin DIMMs, preventing any cross-compatibility between form factors.
  • Thermal constraints in the 17-inch chassis design typically accommodate standard height modules without clearance issues.
  • Manufacturer-installed memory often uses single-sided module layouts, but double-sided modules of equivalent specifications remain electrically compatible.