HP Probook 450 G6 (5x 5PP62EA) RAM upgrade specifications

HP 450 G6 (5x 5PP62EA) HP 450 G6 (5x 5PP62EA) HP 450 G6 (5x 5PP62EA) HP 450 G6 (5x 5PP62EA) HP 450 G6 (5x 5PP62EA)

HP ProBook 450 G6 (5x 5PP62EA) features DDR4-SDRAM memory with two SO-DIMM slots supporting maximum capacity of 32 GB. RAM upgrade specifications indicate compatible memory operates at 2400 MHz frequency. Slots accommodate SO-DIMM form factor modules. The laptop memory upgrade supports DDR4 technology across both available slots for system expansion and performance enhancement.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date20 April 2019

Additional Notes

  • The HP ProBook 450 G6 (5x 5PP62EA) dual-channel architecture requires matched pairs for optimal memory bandwidth, though asymmetric configurations will function at reduced performance.
  • DDR4-2400 represents the maximum validated frequency, meaning higher-speed modules will automatically downclock to this ceiling regardless of their rated specifications.
  • The 32 GB ceiling enforces a maximum 16 GB capacity per module, eliminating 32 GB single-module configurations from consideration.
  • SO-DIMM physical dimensions differ substantially from standard DIMM desktop modules, preventing cross-compatibility despite identical electrical specifications.
  • Both memory slots occupy the same access panel on the underside chassis, allowing simultaneous replacement without additional disassembly steps.
  • Non-ECC unbuffered modules constitute the only supported topology, as registered or error-correcting variants will trigger initialization failures.
  • Single-rank versus dual-rank module architecture affects interleaving efficiency, with mixed configurations potentially degrading memory controller throughput.
  • Voltage specifications lock at 1.2V standard for DDR4, preventing low-voltage or overclocking-oriented modules from operating outside this parameter.
  • The 260-pin SO-DIMM connector standard remains physically incompatible with previous DDR3 generation modules despite superficially similar form factors.
  • Maintaining factory seals during user-accessible memory upgrades typically preserves warranty coverage, unlike soldered storage modifications.