HP Probook 640 G1 Base Model RAM upgrade specifications

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HP Probook 600 series 640 G1 Base Model supports DDR3-SDRAM memory upgrades with 2x SO-DIMM slots. Maximum RAM capacity reaches 16 GB total. Compatible memory modules feature SO-DIMM form factor operating at 1600 MHz frequency. Upgrade specifications enable configuration of additional memory capacity within the stated maximum limit, allowing expansion from factory default configurations.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR3-SDRAM
Frequency1600 MHz
Maximum RAM16 GB
Voltage1.5V
Number of pins204-pin
InterfacePC3
PC Speed RatingPC3-1600 (PC3-12800)
Bandwidth12.8 GB/s
Laptop Release date31 January 2015

Additional Notes

  • The HP ProBook 640 G1 Base Model chipset architecture limits total memory capacity to 16 GB across both slots, requiring 8 GB modules in dual-channel configuration to reach maximum capacity.
  • DDR3-SDRAM operates at 1.5V standard voltage, distinguishing it from low-voltage DDR3L modules at 1.35V, which may affect module compatibility depending on BIOS implementation.
  • The 1600 MHz specification indicates PC3-12800 rating, establishing the minimum transfer rate requirement of 12.8 GB/s for compatible modules.
  • SO-DIMM form factor measures 67.6 mm in length compared to standard desktop DIMM at 133.35 mm, physically preventing installation of incompatible desktop memory modules.
  • Dual-channel architecture requires matched module pairs in both slots to enable 128-bit memory bus width, doubling theoretical bandwidth from 12.8 GB/s to 25.6 GB/s.
  • Fourth-generation Intel Core mobile processors in this platform support DDR3-1600 natively, eliminating the need for frequency downclocking when specified modules are installed.
  • The 2-slot configuration necessitates removal of existing modules when upgrading beyond the factory-installed capacity, as no additional slots provide expansion headroom.
  • CAS latency timings of CL11 represent the standard specification for DDR3-1600, though modules with tighter CL9 timings remain backward compatible at reduced latency.
  • Non-ECC unbuffered modules are required for this consumer-grade platform, as registered or ECC memory types introduce incompatibility with the mobile chipset.
  • Module height restrictions in SO-DIMM laptop installations typically limit compatibility to standard-profile chips, excluding high-profile heat spreaders common in performance desktop memory.