MSI Creator 15 A10SET-052 RAM upgrade specifications
MSI Creator 15 A10SET-052 laptop memory upgrade specifications include DDR4-SDRAM compatibility with 2x SO-DIMM slots supporting maximum RAM capacity of 64 GB. Memory operates at 2666 MHz frequency with SO-DIMM form factor. Compatible upgrade modules expand the laptop's existing memory configuration for enhanced multitasking and performance capabilities.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 17 December 2020 |
Additional Notes
- The dual-slot configuration allows for the utilization of dual-channel memory architecture, which doubles the communication bandwidth between the processor and the memory controller.
- Installing a single module will result in single-channel operation, potentially creating a bottleneck during memory-intensive rendering tasks typical for the MSI Creator 15 A10SET-052 series.
- High-density 32 GB modules are necessary to reach the maximum supported capacity, as the physical motherboard footprint is limited to 2 SO-DIMM interfaces.
- Latency performance will default to the highest common denominator if modules with mismatched CAS latency ratings are installed together.
- The system architecture supports 2666 MHz speeds, meaning higher frequency modules like 3200 MHz will automatically downclock to match the hardware limitations of the chipset.
- Upgrading memory requires the removal of the bottom chassis panel, which may involve penetrating a factory seal sticker depending on regional warranty policies.
- The use of SO-DIMM modules ensures compatibility with standard 260-pin DDR4 laptop hardware but precludes the use of low-power LPDDR4 variants which are typically soldered.
- Physical clearance within the slim chassis restricts the use of modules equipped with tall integrated heat spreaders.