MSI Gaming GF63 11UC-455NL Thin RAM upgrade specifications

MSI GF63 11UC-455NL Thin MSI GF63 11UC-455NL Thin MSI GF63 11UC-455NL Thin MSI GF63 11UC-455NL Thin MSI GF63 11UC-455NL Thin

MSI GF63 11UC-455NL Thin gaming laptop supports DDR4-SDRAM memory upgrades through 2x SO-DIMM slots. Maximum RAM capacity reaches 64 GB total. Compatible memory operates at 3200 MHz frequency. Upgrade specifications enable expansion from factory configuration to full 64 GB capacity using standard SO-DIMM form factor modules. Gaming series GF model accommodates dual-channel memory configuration for enhanced performance. DDR4 technology compatibility ensures reliable operation within laptop specifications.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date26 January 2022

Additional Notes

  • Dual channel architecture requires matching memory modules in both slots to maximize memory bandwidth and reduce system latency during intensive processing.
  • The 64 GB capacity limit necessitates the use of high density 32 GB modules per slot which may require a BIOS update for proper recognition of specific memory ranks.
  • Utilizing memory modules with speeds exceeding 3200 MHz results in automatic downclocking to the processor memory controller limit regardless of the advertised module frequency.
  • Lowering the CAS latency through high performance aftermarket RAM modules can improve frame time consistency in the MSI GF63 11UC-455NL Thin during gaming sessions.
  • Physical access to the internal SO-DIMM slots requires the removal of the bottom chassis cover which typically involves penetrating a factory seal sticker and potentially affecting regional warranty terms.
  • Single rank versus dual rank configuration choices impact the thermal profile of the memory area due to the restricted airflow within the low profile chassis design.
  • Upgrading from a single factory module to a dual module configuration provides a significant performance boost for applications dependent on integrated graphics or multi threaded workloads.
  • The absence of soldered memory ensures that both physical slots are fully replaceable allowing for a complete transition to higher efficiency 1.2V memory kits.