MSI Gaming GF75 10SCXR-255FR Thin RAM upgrade specifications
The MSI GF75 10SCXR-255FR Thin gaming laptop features DDR4-SDRAM memory upgrade specifications with two SO-DIMM slots supporting maximum capacity of 64 GB RAM. Memory modules operate at 2666 MHz frequency. Compatible upgrade options include DDR4 SO-DIMM modules within specified frequency parameters. Current and replacement memory configurations must match SO-DIMM form factor specifications for proper compatibility with the GF series gaming notebook.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 16 December 2020 |
Additional Notes
- The dual-slot configuration allows for dual-channel memory architecture which doubles the potential bandwidth between the CPU and system memory.
- Installing modules with frequencies higher than 2666 MHz results in an automatic downclocking to the system bus limit determined by the 10th generation chipset.
- Upgrading the MSI GF75 10SCXR-255FR Thin requires the removal of the entire bottom chassis cover as there is no dedicated service hatch for memory access.
- Maximum capacity is achieved only through the use of 32 GB high-density modules in both available SO-DIMM slots.
- Thermal constraints within the thin chassis design suggest that utilizing low-voltage 1.2V modules is necessary to prevent localized heat buildup near the motherboard.
- Mixing modules with different latencies or ranks can cause the system to revert to the slowest timing profile or lead to boot failures.
- The internal layout requires the disconnection of the battery internally before handling RAM modules to prevent static discharge or short circuits to the logic board.