MSI Gaming GL63 8SD-298FR RAM upgrade specifications

MSI GL63 8SD-298FR MSI GL63 8SD-298FR MSI GL63 8SD-298FR MSI GL63 8SD-298FR MSI GL63 8SD-298FR

The MSI GL63 8SD-298FR Gaming series laptop features DDR4-SDRAM memory with two SO-DIMM slots for RAM upgrade capabilities. Compatible memory modules operate at 2666 MHz frequency. The system supports a maximum RAM capacity of 32 GB total, allowing users to expand memory from the factory configuration. Specifications indicate SO-DIMM form factor modules are required for upgrade compatibility with this Gaming GL series model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date13 May 2019

Additional Notes

  • The MSI GL63 8SD-298FR accepts only notebook-sized memory modules, preventing the use of standard desktop DIMM sticks regardless of specification matching.
  • The 2666 MHz frequency limit stems from the Intel 8th generation Coffee Lake-H chipset architecture, which will downclock any faster modules to this native speed.
  • Installing a single module instead of matched pairs eliminates dual-channel operation, reducing memory bandwidth from 42.6 GB/s to 21.3 GB/s.
  • The 32 GB ceiling requires two 16 GB modules, as single 32 GB SO-DIMM sticks exceed the memory controller's per-slot addressing capability.
  • Mixing modules with different CAS latencies forces all memory to operate at the slowest timing present, potentially degrading performance below rated specifications.
  • Non-JEDEC voltage modules rated above 1.2V may trigger compatibility issues or prevent POST completion despite correct form factor and speed.
  • The Coffee Lake platform lacks native support for DDR4-3200, meaning such modules will automatically default to 2666 MHz without BIOS intervention options.
  • Accessing both SO-DIMM slots on this chassis typically requires complete bottom panel removal rather than dedicated service hatches.
  • ECC SO-DIMM modules physically fit but remain incompatible, as the HM370 chipset does not support error-correcting code functions.
  • Warranty preservation requires using modules meeting JEDEC DDR4-2666 standards, as overclocked XMP profiles may void coverage under certain regional policies.