MSI Gaming GL63 8SDK-486XRU RAM upgrade specifications
The MSI GL63 8SDK-486XRU gaming laptop features DDR4-SDRAM memory upgrade capabilities. The system includes 2x SO-DIMM memory slots supporting a maximum RAM capacity of 32 GB. Compatible memory modules operate at 2666 MHz frequency with SO-DIMM form factor specifications. The GL series gaming model accepts DDR4 memory upgrades to reach maximum supported capacity, with each slot accommodating compatible RAM modules. Upgrade specifications are limited to DDR4-SDRAM technology within the defined frequency and slot configuration parameters.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 13 May 2019 |
Additional Notes
- Dual channel architecture requires matching memory module pairs to achieve full theoretical data transfer rates and reduce memory controller latency.
- The MSI GL63 8SDK-486XRU motherboard chipset limits memory bandwidth to 2666 MHz regardless of higher rated modules being installed.
- Internal component access for memory installation involves removing the entire bottom chassis cover which may require specialized plastic prying tools to avoid snapping plastic retaining clips.
- Installing 32 GB of total memory necessitates the removal of any existing factory modules because the system utilizes both available slots for its maximum capacity.
- Compatibility is restricted to ECC unbuffered 260 pin physical modules as the hardware lacks support for registered or buffered server grade memory.
- System stability depends on using 1.2V low voltage modules since the BIOS lacks manual voltage offset controls for high performance overclocked memory kits.
- Thermal dissipation for the RAM depends on passive airflow within the chassis as there are no dedicated heat sinks or active cooling fans for the memory slots.