MSI Gaming GL75 10SEK-261XES Leopard RAM upgrade specifications
The MSI GL75 10SEK-261XES Leopard gaming laptop features DDR4-SDRAM memory upgradeable via two SO-DIMM slots. Maximum supported RAM capacity reaches 64 GB with compatible modules operating at 2666 MHz frequency. Specifications allow for memory expansion from the factory configuration, accommodating DDR4 SO-DIMM form factor upgrades. The GL series gaming model supports dual-channel memory architecture for enhanced performance. Users upgrading RAM must verify DDR4 compatibility and SO-DIMM slot specifications matching the MSI GL75 10SEK-261XES Leopard platform requirements.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 22 June 2020 |
Additional Notes
- The dual channel architecture requires identical module capacities in both slots to provide maximum memory bandwidth for the processor.
- The MSI GL75 10SEK-261XES Leopard motherboard utilizes a specific chipset that limits the memory controller to a hardware cap of 64 GB regardless of higher capacity modules available on the market.
- Installing modules with frequencies higher than 2666 MHz results in automatic downclocking to match the system bus speed limit.
- Upgrading memory requires the removal of the entire bottom chassis panel which may involve piercing a factory seal sticker in certain regions.
- The use of high density 32 GB sticks is necessary to reach the maximum supported capacity due to the lack of additional expansion slots.
- Latency timings are governed by the slowest installed module if mismatched sticks are used in the two available slots.
- The physical height of the SO-DIMM slots restricts upgrades to standard height modules and precludes the use of integrated heat spreaders that exceed vertical clearance limits inside the thin laptop casing.