MSI Gaming GL76 12UEK-056XIT Pulse RAM upgrade specifications
MSI GL76 12UEK-056XIT Pulse gaming laptop features DDR4-SDRAM memory upgrade specifications with two SO-DIMM slots. Maximum RAM capacity reaches 64 GB total, supporting DDR4 memory modules operating at 3200 MHz frequency. Compatible memory upgrades utilize SO-DIMM form factor for the GL series gaming platform. Specifications indicate dual-slot configuration enabling modular memory expansion from factory configuration to maximum supported capacity. GL76 Pulse series supports DDR4-SDRAM upgrade modules for enhanced multitasking and performance applications.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 22 January 2022 |
Additional Notes
- The MSI GL76 12UEK-056XIT Pulse memory controller supports dual-channel architecture through its 2 SO-DIMM slots, requiring matched pairs for optimal bandwidth utilization.
- DDR4-3200 represents the JEDEC standard configuration, meaning modules rated at higher XMP frequencies will downclock to 3200 MHz on this platform.
- The 64 GB ceiling indicates compatibility with 32 GB density modules per slot, which remains platform-dependent on the 12th generation Intel memory controller implementation.
- SO-DIMM form factor necessitates laptop-specific modules measuring 67.6 mm in length, incompatible with standard 133.35 mm desktop DIMMs.
- Single-channel operation occurs when only one slot is populated, reducing memory bandwidth by approximately 50 percent compared to dual-channel configuration.
- Access to memory slots typically requires bottom panel removal, with potential warranty implications if security seals are present on chassis fasteners.
- Mixing modules with different speeds forces all installed RAM to operate at the lowest common frequency and highest common latency timings.
- Voltage specifications for DDR4-3200 default to 1.2V, though some aftermarket modules may require BIOS voltage adjustments not available on locked mobile platforms.
- Asymmetric capacity configurations such as 16 GB plus 8 GB will operate in flex mode, providing dual-channel benefits only up to the smaller module's capacity threshold.
- Non-ECC unbuffered modules remain the standard requirement for consumer mobile platforms, as registered or ECC memory types cause POST failures.
- The physical slot orientation in mobile platforms places modules parallel to the motherboard plane, secured by side retention clips rather than vertical insertion methods.