MSI Gaming GP62M 7REX-1640AU Leopard Pro RAM upgrade specifications

MSI GP62M 7REX-1640AU Leopard Pro MSI GP62M 7REX-1640AU Leopard Pro MSI GP62M 7REX-1640AU Leopard Pro MSI GP62M 7REX-1640AU Leopard Pro

The MSI GP62M 7REX-1640AU Leopard Pro gaming laptop features two SO-DIMM memory slots supporting DDR4-SDRAM modules at 2400 MHz frequency. Maximum RAM capacity reaches 32 GB total, allowing for significant memory upgrade potential. The upgrade specifications indicate compatibility with standard DDR4 SO-DIMM memory modules, enabling users to expand existing memory configurations to the maximum supported capacity. Memory upgrades require compatible DDR4-SDRAM modules operating at 2400 MHz specifications for optimal performance and compatibility with the GP62M series motherboard configuration.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date21 January 2018

Additional Notes

  • The dual channel architecture requires installing identical memory pairs to enable interleaved data access and double the peak memory bandwidth.
  • The system firmware downclocks modules rated for 2666 MHz or higher to 2400 MHz to maintain signal stability across the motherboard traces.
  • Upgrading the MSI GP62M 7REX-1640AU Leopard Pro to the 32 GB limit necessitates a 2 by 16 GB configuration because the chipset does not support dense 32 GB single sticks.
  • Access to the internal slots involves removing the entire lower chassis cover which may require breaking a factory seal depending on regional service policies.
  • Compatibility is restricted to 1.2V low voltage modules while older 1.5V DDR3 hardware remains physically and electrically incompatible with the SO-DIMM sockets.
  • The Intel 7th generation processor integrated memory controller acts as the primary bottleneck for latency regardless of the Cas Latency ratings on aftermarket sticks.
  • Internal thermal management relies on clear airflow around the components so high profile memory heat spreaders could potentially interfere with the base panel fitment.