MSI Gaming GS73VR 7RG(Stealth Pro)-088FR RAM upgrade specifications

MSI GS73VR 7RG(Stealth Pro)-088FR MSI GS73VR 7RG(Stealth Pro)-088FR MSI GS73VR 7RG(Stealth Pro)-088FR MSI GS73VR 7RG(Stealth Pro)-088FR MSI GS73VR 7RG(Stealth Pro)-088FR

The MSI GS73VR 7RG(Stealth Pro)-088FR Gaming series laptop features two SO-DIMM memory slots supporting DDR4-SDRAM upgrades at 2400 MHz frequency. Maximum RAM capacity specifications indicate compatibility with up to 32 GB total memory. Upgrade specifications for this model accommodate DDR4 memory modules in SO-DIMM form factor, enabling users to expand installed memory capacity by utilizing available slots. Compatible upgrades must conform to DDR4-SDRAM specifications and SO-DIMM physical format standards.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date12 November 2018

Additional Notes

  • Internal motherboard layout requires the removal of the heat pipe assembly and the entire system board to access memory slots because they are located on the underside of the PCB.
  • Dual channel memory configurations reach peak bandwidth only when 2 identical modules are installed due to the chipset architecture.
  • High performance modules with lower CAS latency ratings provide better frame time consistency in gaming scenarios than standard JEDEC modules.
  • The processor memory controller limits faster 2666 MHz or 3200 MHz modules to the native 2400 MHz system speed.
  • Upgrading beyond the 32 GB threshold results in a failure to post because the BIOS firmware lacks the address mapping for 32 GB high density sticks.
  • The chassis utilizes thin 260 pin SO-DIMM slots which are incompatible with desktop DIMM or older DDR3 voltage standards.
  • Replacing factory RAM requires breaking the factory seal sticker over a screw hole which may impact regional warranty coverage.
  • Thermal management constraints in the Stealth Pro chassis suggest avoiding modules with thick integrated heat spreaders to prevent physical interference with the bottom panel.