MSI Gaming GT76 9SF-013 Titan RAM upgrade specifications

MSI GT76 9SF-013 Titan MSI GT76 9SF-013 Titan MSI GT76 9SF-013 Titan MSI GT76 9SF-013 Titan MSI GT76 9SF-013 Titan

The MSI GT76 9SF-013 Titan gaming laptop features DDR4-SDRAM memory upgrade specifications. The system contains 4 SO-DIMM slots supporting maximum RAM capacity of 128 GB. Memory operates at 2666 MHz frequency. Compatible upgrades utilize SO-DIMM form factor specifications. The GT76 series supports DDR4-SDRAM modules for memory expansion and system performance enhancement.

Memory Upgrade Specifications

SpecificationValue
Memory slots4x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM128 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date13 August 2019

Additional Notes

  • The presence of 4 memory slots requires a dual bank architecture where components are often divided between the top and bottom of the motherboard, necessitating significant disassembly of the MSI GT76 9SF-013 Titan to reach all locations.
  • Utilizing all 4 slots with high capacity modules increases the thermal load within the chassis requiring the cooling system to manage additional radiant heat from the memory area.
  • Mixing modules of different densities or ranks across the 4 slots will result in the system defaulting to the lowest common denominator for timings and potentially disabling dual channel interleaving.
  • The 128 GB maximum threshold indicates support for 32 GB high density modules which may require a specific BIOS version to recognize the full capacity across all banks.
  • Installing memory with XMP profiles exceeding the 2666 MHz base frequency will result in automatic downclocking to the processor bus limit regardless of the module rating.
  • Latency performance depends on populating slots in matched pairs to maintain symmetrical bandwidth across the integrated memory controller.
  • Physical clearance for stackable SO-DIMM configurations restricts the use of modules with thick integrated heat spreaders due to vertical height limitations between the board and the casing.