MSI Modern 15 A5M-029XIT RAM upgrade specifications
MSI 15 A5M-029XIT laptop memory upgrade specifications include DDR4-SDRAM compatible RAM utilizing 2x SO-DIMM slots. Maximum supported capacity reaches 64 GB total memory. Specifications indicate DDR4 frequency of 3200 MHz. SO-DIMM form factor RAM modules are required for upgrade compatibility. Existing memory configurations can be expanded to maximum capacity through the two available slots. Memory specifications support standard DDR4 SDRAM technology for Modern series 15-inch models.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 02 November 2021 |
Additional Notes
- The dual slot architecture requires identical module pairs to activate dual channel bandwidth and prevent memory throttling during multicore processing tasks.
- Installing high capacity modules in the MSI Modern 15 A5M-029XIT necessitates careful handling of the internal ribbon cables located near the memory bank area during the bottom panel removal.
- System stability depends on using non ECC unbuffered modules because the motherboard chipset does not support error correcting code functionality for server grade hardware.
- Standard 1.2V modules are required for operation since the BIOS does not typically allow for voltage adjustments associated with high performance overclocking memory.
- Reaching the maximum 64 GB limit involves replacing both factory installed modules simultaneously because the system lacks additional expansion bays beyond the primary two slots.
- Memory modules with a CAS latency higher than 22 at 3200 MHz will cause a performance bottleneck by increasing data access delays for the processor.
- Component height must adhere to the standard SO-DIMM profile to ensure the thermal pad remains in contact with the chassis for heat dissipation.