MSI Modern 15 A5M-029XIT RAM upgrade specifications

MSI 15 A5M-029XIT MSI 15 A5M-029XIT MSI 15 A5M-029XIT MSI 15 A5M-029XIT MSI 15 A5M-029XIT

MSI 15 A5M-029XIT laptop memory upgrade specifications include DDR4-SDRAM compatible RAM utilizing 2x SO-DIMM slots. Maximum supported capacity reaches 64 GB total memory. Specifications indicate DDR4 frequency of 3200 MHz. SO-DIMM form factor RAM modules are required for upgrade compatibility. Existing memory configurations can be expanded to maximum capacity through the two available slots. Memory specifications support standard DDR4 SDRAM technology for Modern series 15-inch models.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date02 November 2021

Additional Notes

  • The dual slot architecture requires identical module pairs to activate dual channel bandwidth and prevent memory throttling during multicore processing tasks.
  • Installing high capacity modules in the MSI Modern 15 A5M-029XIT necessitates careful handling of the internal ribbon cables located near the memory bank area during the bottom panel removal.
  • System stability depends on using non ECC unbuffered modules because the motherboard chipset does not support error correcting code functionality for server grade hardware.
  • Standard 1.2V modules are required for operation since the BIOS does not typically allow for voltage adjustments associated with high performance overclocking memory.
  • Reaching the maximum 64 GB limit involves replacing both factory installed modules simultaneously because the system lacks additional expansion bays beyond the primary two slots.
  • Memory modules with a CAS latency higher than 22 at 3200 MHz will cause a performance bottleneck by increasing data access delays for the processor.
  • Component height must adhere to the standard SO-DIMM profile to ensure the thermal pad remains in contact with the chassis for heat dissipation.