MSI Prestige P65 9SE-1450 Creator RAM upgrade specifications
The MSI Prestige P65 9SE-1450 Creator laptop features two SO-DIMM memory slots supporting DDR4-SDRAM upgrades. Maximum supported capacity reaches 64 GB total memory configuration. Compatible RAM operates at 2666 MHz frequency specifications. Upgrade options accommodate SO-DIMM form factor modules for enhanced multitasking and content creation performance on the P Series Creator platform.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 15 May 2020 |
Additional Notes
- The internal layout of the MSI P65 9SE-1450 Creator requires a flipped motherboard orientation for RAM access, necessitating the removal of the entire mainboard from the chassis to reach the SO-DIMM slots.
- Dual-channel memory architecture is only achievable when installing pairs of identical modules, as asymmetrical capacities will default to single-channel performance for the remaining addressable space.
- The processor architecture limits memory speed to a baseline of 2666 MHz, meaning higher frequency modules will automatically downclock to match the system bus limitations.
- Installation of 64 GB of memory requires 32 GB high-density modules which typically generate higher thermal output within the thin-and-light chassis during sustained rendering tasks.
- Integrated graphics performance scales directly with memory bandwidth, so populating both slots significantly improves video playback and creative software UI responsiveness compared to single-slot configurations.
- Upgrading memory involves breaking a factory seal on a chassis screw, which indicates a potential impact on warranty status in specific regional jurisdictions.
- Physical clearance for memory is restricted by the ultra-thin profile, limiting compatibility to standard height modules without integrated heat spreaders.