ACER TravelMate TMP414RN-52-73DL RAM upgrade specifications

ACER TMP414RN-52-73DL ACER TMP414RN-52-73DL ACER TMP414RN-52-73DL ACER TMP414RN-52-73DL ACER TMP414RN-52-73DL

Acer TravelMate Spin P4 series model TMP414RN-52-73DL features DDR4-SDRAM memory upgrade specifications. Laptop contains 2x SO-DIMM slots supporting maximum RAM capacity of 32 GB. Compatible memory modules operate at 2133 MHz frequency. Upgrade specifications enable end-users to expand existing memory capacity by utilizing available SO-DIMM slots. Maximum memory configuration reaches 32 GB total capacity for enhanced multitasking performance. DDR4-SDRAM upgrade components must match specified frequency and form factor requirements for compatibility with TravelMate Spin P4 notebook specifications.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date10 April 2023

Additional Notes

  • The presence of 2 physical SO-DIMM slots confirms that the ACER TravelMate TMP414RN-52-73DL supports a full dual-channel memory architecture, which doubles the theoretical bandwidth compared to single-channel configurations.
  • The 2133 MHz frequency limit suggests the system bus will downclock higher-rated modules, meaning 2400 MHz or 3200 MHz sticks will function but only at the lower native speed of the motherboard.
  • A 32 GB maximum capacity implies that each individual slot can address a maximum of 16 GB, preventing the use of high-density 32 GB single modules.
  • Replacing factory-installed memory does not typically void the hardware warranty as long as no physical damage occurs to the internal clips or the motherboard during the installation process.
  • The reliance on DDR4-SDRAM SO-DIMM modules ensures compatibility with standard 260-pin hardware, though the lower clock speed may create a minor performance bottleneck during memory-intensive multitasking or integrated graphics rendering.
  • Proper heat dissipation must be maintained during upgrades because the compact internal layout of this series requires modules to be seated without obstructing the airflow paths of the cooling fan.