ASUS ROG G513IC-HN108W RAM upgrade specifications

ASUS G513IC-HN108W ASUS G513IC-HN108W ASUS G513IC-HN108W ASUS G513IC-HN108W ASUS G513IC-HN108W

The ASUS ROG Strix G15 G513IC-HN108W features DDR4-SDRAM memory with two SO-DIMM slots for upgrade capabilities. Compatible RAM modules operate at 3200 MHz frequency. The laptop supports a maximum RAM capacity of 32 GB total memory across both slots. Specifications indicate SO-DIMM form factor compatibility for memory module installation and configuration.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date13 October 2022

Additional Notes

  • DDR4-SDRAM at 3200 MHz operates within the JEDEC standard range for laptop memory, meaning third-party modules rated at this speed will function without requiring BIOS adjustments or overclocking profiles.
  • The 2 SO-DIMM slot configuration on the ASUS ROG G513IC-HN108W requires full module replacement to reach the 32 GB ceiling; upgrading from a single 8 GB factory module necessitates removing the original stick rather than adding capacity alongside existing hardware.
  • DDR4 SO-DIMM modules of 3200 MHz specification are commodity components widely available in laptop upgrade channels, reducing compatibility risk and establishing predictable pricing for capacity increases.
  • The maximum capacity of 32 GB dictates that memory will not constrain gaming workloads or professional applications, though bandwidth limitations inherent to DDR4 versus newer DDR5 architecture persist for bandwidth-intensive compute tasks.
  • SO-DIMM form factor confinement means Kingston, Crucial, and Corsair modules engineered for mobile platforms will install correctly; desktop DDR4 UDIMM sticks cannot physically fit the laptop's socket configuration.
  • Dual-slot architecture eliminates single-channel operation scenarios; matching paired modules in capacity and speed optimizes memory bandwidth delivery to the CPU and iGPU, whereas mismatched modules default to the slower device's rated frequency.