ASUS ROG G713QR-K4048T RAM upgrade specifications

ASUS G713QR-K4048T ASUS G713QR-K4048T ASUS G713QR-K4048T ASUS G713QR-K4048T ASUS G713QR-K4048T

The ASUS ROG Strix G17 G713QR-K4048T laptop features 2x SO-DIMM memory slots supporting DDR4-SDRAM modules at 3200 MHz frequency. Maximum RAM capacity reaches 32 GB total. Compatible upgrade modules must match DDR4-SDRAM specifications and SO-DIMM form factor. Memory expansion specifications enable users to upgrade existing RAM configurations up to the maximum supported capacity of 32 GB.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date01 July 2021

Additional Notes

  • The ASUS ROG G713QR-K4048T supports dual-channel memory operation through its 2 SO-DIMM slots, enabling theoretical bandwidth of 51.2 GB/s when populated with matched modules at 3200 MHz.
  • Single-channel configurations reduce memory bandwidth by approximately 50%, creating performance bottlenecks in GPU-intensive applications and gaming scenarios where this system's dedicated graphics rely on rapid data transfers.
  • The 32 GB maximum capacity limitation stems from chipset addressing constraints, preventing use of individual modules exceeding 16 GB regardless of future JEDEC specifications for higher-density SO-DIMMs.
  • Mixing modules with different speeds forces all installed memory to operate at the lowest common frequency, negating the performance benefits of faster-rated modules.
  • Non-matching CAS latencies between mixed modules cause the memory controller to apply the highest latency timing across all channels, increasing effective latency beyond what individual module specifications suggest.
  • DDR4 SO-DIMM modules operate at 1.2V standard voltage, with certain XMP/overclocked profiles requiring voltage adjustments that may exceed thermal design tolerances in compact laptop chassis.
  • Accessing memory slots typically requires complete bottom panel removal, with potential warranty implications if tamper-evident seals are present or damaged during disassembly.
  • ECC memory modules present physical compatibility but lack functional support in consumer-grade implementations, operating only in non-ECC mode with error correction features disabled.
  • The 3200 MHz specification represents JEDEC standard DDR4-3200, distinguishing it from overclocked speeds that require BIOS-level XMP profile activation not universally available in laptop firmware.
  • Rank configuration affects compatibility, as dual-rank modules impose higher electrical loads on the memory controller that may prevent stable operation when populating both slots at maximum capacity.