ASUS ROG G733QS-HG026T RAM upgrade specifications

ASUS G733QS-HG026T ASUS G733QS-HG026T ASUS G733QS-HG026T ASUS G733QS-HG026T ASUS G733QS-HG026T

ASUS ROG Strix SCAR 17 G733QS-HG026T laptop features dual SO-DIMM slots supporting DDR4-SDRAM memory upgrades. Maximum RAM capacity reaches 64 GB total, with compatible memory operating at 3200 MHz frequency. Specifications indicate standard SO-DIMM form factor modules compatible with upgrade configurations. Two memory slots enable independent module installation for RAM expansion on the G733QS-HG026T model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date12 January 2021

Additional Notes

  • The ASUS ROG G733QS-HG026T supports dual-channel memory architecture through its 2 SO-DIMM slots, enabling doubled theoretical bandwidth compared to single-channel configurations when matched modules are installed.
  • The 64 GB maximum capacity requires 32 GB modules in both slots, which may command premium pricing compared to more common 16 GB density modules.
  • DDR4-3200 represents the JEDEC standard speed for this generation, meaning modules rated higher than 3200 MHz will downclock to this frequency unless XMP profiles are supported and enabled in BIOS.
  • SO-DIMM form factor limits thermal headroom compared to full-size DIMMs, potentially affecting sustained performance under heavy memory workloads in confined laptop chassis.
  • Mixing modules with different speeds or timings will force all installed memory to operate at the lowest common denominator specifications.
  • The absence of quad-channel support means bandwidth scaling plateaus after populating both available slots, regardless of total capacity installed.
  • DDR4 voltage compatibility typically ranges between 1.2V and 1.35V, with higher voltage XMP profiles potentially voided under manufacturer warranty policies.
  • Accessing SO-DIMM slots may require bottom panel removal, with potential seal breakage affecting warranty status depending on regional consumer protection laws.
  • The 3200 MHz frequency provides approximately 25.6 GB/s theoretical bandwidth per channel, totaling 51.2 GB/s in dual-channel mode under ideal conditions.
  • CAS latency specifications become critical at this frequency tier, with CL22 modules delivering approximately 13.75 nanoseconds true latency versus 12.5 nanoseconds for CL20 variants.
  • ECC memory modules are incompatible with this consumer-grade platform, limiting error correction to standard parity checking only.
  • Unmatched module pairing may trigger flex mode operation, where only the overlapping capacity runs in dual-channel while excess capacity reverts to single-channel bandwidth.