ASUS ROG GL702VM-BA309T RAM upgrade specifications

ASUS GL702VM-BA309T ASUS GL702VM-BA309T ASUS GL702VM-BA309T ASUS GL702VM-BA309T ASUS GL702VM-BA309T

The ASUS ROG Strix GL702VM-BA309T gaming laptop features two SO-DIMM memory slots supporting DDR4-SDRAM modules at 2400 MHz frequency. The upgrade specifications indicate maximum RAM capacity of 32 GB total, accommodating compatible DDR4 SO-DIMM memory upgrades. This configuration allows for flexible RAM expansion to meet demanding gaming and professional workload requirements on the GL702VM-BA309T platform.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date12 November 2018

Additional Notes

  • The 2 SO-DIMM configuration requires replacing existing modules rather than adding to them when reaching capacity limits.
  • DDR4-2400 operates on 1.2V standard, incompatible with DDR3 or DDR3L modules from older systems.
  • The 32 GB maximum divides into 2x16 GB modules, as 2x8 GB configurations would leave half the potential capacity unused.
  • SO-DIMM physical dimensions differ from desktop DIMM modules, preventing cross-compatibility with standard tower RAM.
  • Memory speeds exceeding 2400 MHz will downclock to match the chipset specification, wasting premium module costs.
  • Dual-channel architecture requires matched pairs for optimal bandwidth utilization across both slots.
  • The notch position on DDR4 SO-DIMM prevents accidental insertion of incompatible memory generations.
  • Single-rank versus dual-rank module topology may affect compatibility despite matching speed and capacity specifications.
  • Non-ECC unbuffered modules are standard for this consumer platform, as ECC memory would not function.
  • CAS latency variations at 2400 MHz (CL15, CL16, CL17) remain within acceptable tolerance for this chipset.
  • Access to memory slots typically requires bottom panel removal, voiding certain regional warranty seals depending on jurisdiction.
  • Mixing manufacturers or module specifications between slots may cause instability or force operation at lowest common denominator speeds.