ASUS ROG GL702VS-GC045T RAM upgrade specifications

ASUS GL702VS-GC045T ASUS GL702VS-GC045T ASUS GL702VS-GC045T ASUS GL702VS-GC045T ASUS GL702VS-GC045T

The ASUS ROG Strix GL702VS-GC045T laptop features DDR4-SDRAM memory with two SO-DIMM slots supporting a maximum RAM capacity of 32 GB. The memory upgrade specifications indicate compatibility with DDR4 modules operating at 2133 MHz frequency. Each SO-DIMM slot accommodates individual memory modules, enabling users to expand the system's total memory capacity up to the maximum supported 32 GB configuration. These specifications define the compatible memory upgrade options for the GL702VS-GC045T model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date18 August 2017

Additional Notes

  • Dual channel architectural symmetry requires matching module densities in both sockets to maximize memory controller throughput.
  • Physical clearance within the chassis restricts compatibility to standard height SO-DIMM modules and precludes the use of integrated heat spreaders.
  • Maximum supported capacity necessitates the replacement of all pre-installed modules due to the exhaustion of available physical interfaces.
  • SPD profiles exceeding 2133 MHz will automatically downclock to the motherboard hard-coded frequency limit regardless of individual module overhead.
  • System stability depends on 1.2V low voltage operation to maintain thermal thresholds within the compact laptop enclosure.
  • Future expansion beyond 32 GB is restricted by chipset addressing limitations even if 32 GB single modules become physically available.
  • Latency performance defaults to the highest common denominator between the two populated slots which necessitates identical CAS latency ratings for optimal timing.
  • Internal component access for memory installation involves the removal of the bottom chassis panel which may trigger intrusion detection or affect structural thermal pads.