ASUS ROG GL704GM-EV013T RAM upgrade specifications

ASUS GL704GM-EV013T ASUS GL704GM-EV013T ASUS GL704GM-EV013T ASUS GL704GM-EV013T ASUS GL704GM-EV013T

The ASUS ROG Strix GL704GM-EV013T laptop features DDR4-SDRAM memory upgrade specifications with two SO-DIMM slots supporting maximum capacity of 32 GB total RAM. Compatible memory modules operate at 2666 MHz frequency. This gaming laptop's memory upgrade slots accommodate standard SO-DIMM form factor modules, enabling users to expand the system's RAM capacity for enhanced multitasking and performance capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date12 September 2018

Additional Notes

  • The ASUS ROG GL704GM-EV013T supports a maximum memory configuration of 32 GB through dual 16 GB modules, as the 2 SO-DIMM slots impose a physical limit on expansion beyond this capacity.
  • The 2666 MHz frequency indicates compatibility with DDR4-2666 modules, though higher-rated modules will operate at this baseline speed due to chipset and processor limitations.
  • Mixing memory modules with different specifications may force the system to operate all modules at the speed and timings of the slowest installed module, potentially degrading performance.
  • SO-DIMM form factor restricts upgrade options to laptop-specific modules, which typically carry a price premium compared to desktop DIMM equivalents with identical specifications.
  • The dual-channel memory architecture requires matched pairs of modules in both slots to achieve optimal bandwidth, as single-module configurations will operate in reduced-bandwidth single-channel mode.
  • Access to the memory slots typically requires bottom panel removal, and users should verify whether the warranty seal placement permits user-serviceable upgrades without voiding coverage.
  • The 2666 MHz specification represents JEDEC standard DDR4 speeds, offering compatibility with a wide range of manufacturers but limiting access to higher-performance XMP profiles common in desktop platforms.
  • Thermal constraints within the laptop chassis may affect sustained memory performance under heavy workloads, particularly when fully populated with high-density modules.
  • Memory timing variations between different module manufacturers can introduce stability issues, making matched kit purchases preferable to individual module acquisitions.