ASUS ROG GL704GM-EV015T RAM upgrade specifications

ASUS GL704GM-EV015T ASUS GL704GM-EV015T ASUS GL704GM-EV015T ASUS GL704GM-EV015T ASUS GL704GM-EV015T

ASUS ROG Strix GL704GM-EV015T laptop features DDR4-SDRAM memory upgrade specifications with two SO-DIMM slots supporting maximum capacity of 32 GB. Compatible memory modules operate at 2666 MHz frequency. Current memory upgrade slots accommodate SO-DIMM form factor modules, enabling system expansion up to the maximum RAM specifications supported by the gaming laptop platform.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date24 October 2018

Additional Notes

  • The ASUS ROG GL704GM-EV015T accepts only laptop-sized SO-DIMM modules, preventing the use of standard desktop DIMM memory sticks due to physical form factor incompatibility.
  • DDR4-2666 represents the maximum supported frequency, meaning faster modules rated at 2933 MHz or 3200 MHz will downclock automatically to 2666 MHz if installed.
  • The 32 GB ceiling implies a maximum of 16 GB per slot when both SO-DIMM sockets are populated, as single 32 GB modules exceed the controller's addressing capability.
  • Dual-channel architecture requires matched pairs of identical capacity modules to achieve maximum memory bandwidth, otherwise the system operates in single-channel mode with reduced throughput.
  • Non-ECC unbuffered modules are required, as registered or error-correcting memory types will cause POST failures or prevent boot sequences.
  • Mixing different frequency modules forces all installed memory to operate at the speed of the slowest module present in the system.
  • Installing mismatched voltage specifications, particularly mixing 1.2V standard DDR4 with 1.35V low-voltage variants, may trigger stability issues or hardware protection shutdowns.
  • The 2666 MHz specification indicates JEDEC standard timing rather than XMP profiles, meaning overclocked gaming memory kits will not achieve their advertised performance levels.
  • Accessing both SO-DIMM slots typically requires bottom panel removal, with potential warranty implications depending on regional seal placement and consumer protection regulations.
  • Single-rank versus dual-rank module architecture affects compatibility with the maximum 32 GB configuration, as some chipsets exhibit density limitations with dual-rank configurations.