ASUS ROG GA401II-HE004 RAM upgrade specifications
ASUS ROG Zephyrus G14 GA401II-HE004 RAM upgrade specifications include DDR4-SDRAM memory compatible with a single SO-DIMM slot. The laptop features on-board memory combined with one upgradeable SO-DIMM slot, supporting a maximum RAM capacity of 24 GB. Memory operates at 3200 MHz frequency. Upgrade specifications indicate the compatible memory type and maximum capacity for this specific laptop model.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 24 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 20 January 2021 |
Additional Notes
- The ASUS ROG GA401II-HE004 contains factory-soldered RAM that cannot be removed or replaced without specialized equipment and risks voiding the manufacturer warranty.
- The single SO-DIMM slot configuration limits future expansion to one additional memory module rather than allowing dual-channel upgrades through matched pairs.
- The 24 GB maximum capacity indicates 8 GB of soldered memory, restricting the SO-DIMM slot to a 16 GB module as the largest compatible option.
- Matching the 3200 MHz frequency specification prevents downclocking penalties that occur when mixing modules of different speeds within the same memory controller.
- DDR4 SO-DIMM modules require 1.2V operating voltage to maintain compatibility with the laptop's power delivery specifications, excluding DDR3L or DDR5 modules.
- The hybrid memory architecture using both soldered and socketed RAM typically operates in asymmetric dual-channel mode up to the capacity of the smaller module, with remaining capacity running in single-channel mode.
- Installing a 16 GB SO-DIMM alongside the soldered 8 GB creates a 16 GB dual-channel segment with the remaining 8 GB defaulting to single-channel operation, impacting memory-intensive workloads differently across the address space.
- CAS latency specifications must align with JEDEC standards for DDR4-3200, typically CL22 for consumer modules, to ensure stable operation without manual timing adjustments.
- The single-slot design eliminates the option to distribute thermal load across multiple modules, concentrating heat generation in one physical location within the chassis.
- Non-ECC unbuffered SO-DIMM modules represent the only compatible type, as ECC or registered memory requires different electrical signaling unsupported by consumer mobile platforms.