ASUS ROG GA401II-HE004T RAM upgrade specifications

ASUS GA401II-HE004T ASUS GA401II-HE004T ASUS GA401II-HE004T ASUS GA401II-HE004T ASUS GA401II-HE004T

ASUS ROG Zephyrus G14 GA401II-HE004T laptop memory upgrade specifications include DDR4-SDRAM memory type with one SO-DIMM slot available for expansion. Maximum RAM capacity reaches 24 GB total, combining on-board memory with the single upgradeable SO-DIMM slot. Compatible memory operates at 3200 MHz frequency. The upgrade slot accepts standard SO-DIMM form factor modules for enhanced system performance and multitasking capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM24 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date20 January 2021

Additional Notes

  • The presence of on board memory indicates that 8 GB of the system total is permanently soldered to the motherboard and cannot be replaced or upgraded.
  • Dual channel memory performance only functions symmetrically when the capacity of the module in the single expansion slot matches the capacity of the soldered memory.
  • Installing a 16 GB module into the available SO-DIMM slot triggers asynchronous dual channel mode which results in 16 GB of memory operating at full bandwidth and the remaining 8 GB operating at single channel speeds.
  • Upgrading the ASUS ROG GA401II-HE004T beyond the factory configuration requires removing the existing module from the lone expansion slot as no vacant slots remain for supplemental memory.
  • The maximum capacity limit prevents the use of 32 GB or 64 GB modules even if the physical DDR4 interface supports them because the system BIOS will likely fail to initialize the excess density.
  • System latency and stability depend on matching the JEDEC timings of the soldered memory since the BIOS lacks manual voltage and timing adjustments for mixed memory configurations.
  • Thermal constraints within the compact chassis necessitate the use of standard 1.2V modules rather than high performance overvolted kits which may cause boot failure or excessive heat soak.