ASUS ROG GA401IV-HA116T-BE RAM upgrade specifications
ASUS ROG Zephyrus G14 model GA401IV-HA116T-BE features DDR4-SDRAM memory upgrade capacity with one SO-DIMM slot supporting maximum 32 GB RAM. The memory configuration consists of on-board soldered memory combined with a single SO-DIMM upgrade slot. Compatible memory modules operate at 3200 MHz frequency. Specifications indicate the laptop supports DDR4 memory upgrades for enhanced performance capabilities through the available SO-DIMM slot. Maximum total memory capacity reaches 32 GB when upgrade slot is populated with appropriate module.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 24 March 2020 |
Additional Notes
- The presence of on board memory indicates that a portion of the system RAM is permanently soldered to the motherboard and cannot be replaced or upgraded.
- System memory operates in a dual channel configuration only when the capacity of the module in the single SO DIMM slot matches the capacity of the integrated on board memory.
- Asymmetrical memory configurations exceeding the capacity of the soldered chip will result in the surplus RAM operating in single channel mode which reduces memory bandwidth for integrated graphics tasks.
- Reaching the 32 GB maximum memory threshold requires a single module installation of a specific density due to the hardware limitations of the ASUS ROG GA401IV-HA116T-BE single expansion slot architecture.
- Latency timings will automatically default to the highest common denominator between the soldered chips and the removable module to ensure system stability.
- The hardware architecture limits future scalability because the lack of a second physical slot prevents the installation of a matched pair of aftermarket high performance kits.
- Thermal dissipation for the memory subsystem is concentrated around the fixed on board area making the expansion slot sensitive to high profile modules that might obstruct airflow.