ASUS ROG GA401IV-HA116T-BE RAM upgrade specifications

ASUS GA401IV-HA116T-BE ASUS GA401IV-HA116T-BE ASUS GA401IV-HA116T-BE ASUS GA401IV-HA116T-BE ASUS GA401IV-HA116T-BE

ASUS ROG Zephyrus G14 model GA401IV-HA116T-BE features DDR4-SDRAM memory upgrade capacity with one SO-DIMM slot supporting maximum 32 GB RAM. The memory configuration consists of on-board soldered memory combined with a single SO-DIMM upgrade slot. Compatible memory modules operate at 3200 MHz frequency. Specifications indicate the laptop supports DDR4 memory upgrades for enhanced performance capabilities through the available SO-DIMM slot. Maximum total memory capacity reaches 32 GB when upgrade slot is populated with appropriate module.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date24 March 2020

Additional Notes

  • The presence of on board memory indicates that a portion of the system RAM is permanently soldered to the motherboard and cannot be replaced or upgraded.
  • System memory operates in a dual channel configuration only when the capacity of the module in the single SO DIMM slot matches the capacity of the integrated on board memory.
  • Asymmetrical memory configurations exceeding the capacity of the soldered chip will result in the surplus RAM operating in single channel mode which reduces memory bandwidth for integrated graphics tasks.
  • Reaching the 32 GB maximum memory threshold requires a single module installation of a specific density due to the hardware limitations of the ASUS ROG GA401IV-HA116T-BE single expansion slot architecture.
  • Latency timings will automatically default to the highest common denominator between the soldered chips and the removable module to ensure system stability.
  • The hardware architecture limits future scalability because the lack of a second physical slot prevents the installation of a matched pair of aftermarket high performance kits.
  • Thermal dissipation for the memory subsystem is concentrated around the fixed on board area making the expansion slot sensitive to high profile modules that might obstruct airflow.