ASUS TUF Gaming FA507NV-LP019W RAM upgrade specifications

ASUS FA507NV-LP019W ASUS FA507NV-LP019W ASUS FA507NV-LP019W ASUS FA507NV-LP019W ASUS FA507NV-LP019W

ASUS TUF Gaming A15 FA507NV-LP019W RAM upgrade specifications indicate DDR5-SDRAM memory compatibility with 2x SO-DIMM slots supporting maximum capacity of 32 GB. The laptop features DDR5 memory operating at 4800 MHz frequency. Compatible RAM modules utilize SO-DIMM form factor for this gaming notebook configuration. Upgrade options allow installation of additional memory modules within specified slots to achieve maximum supported capacity.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency4800 MHz
Maximum RAM32 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-4800 (PC5-38400)
Bandwidth38.4 GB/s

Additional Notes

  • The ASUS TUF Gaming FA507NV-LP019W features a 32 GB ceiling across both slots, requiring either a 16 GB plus 16 GB configuration or asymmetric pairings that total within this limit.
  • DDR5-SDRAM operates at higher voltages than DDR4 modules, preventing backward compatibility with systems designed for previous generation memory standards.
  • The 4800 MHz frequency represents a JEDEC-standardized speed tier rather than a performance ceiling, as DDR5 memory controllers often support higher XMP or EXPO profiles if the chipset and BIOS permit.
  • Dual SO-DIMM architecture enables dual-channel bandwidth operation when matched modules occupy both slots, effectively doubling the theoretical data throughput compared to single-channel configurations.
  • The SO-DIMM form factor measures 67.6 mm in length compared to standard DIMM modules, maintaining physical compatibility with compact laptop chassis constraints.
  • Mixing memory modules with different densities or timings across the 2 slots may force the memory controller to downclock all modules to the lowest common specifications, potentially reducing effective performance.
  • DDR5 architecture incorporates on-die ECC at the DRAM level, distinct from server-grade registered ECC, functioning transparently without user configuration or operating system awareness.
  • Accessing the memory slots typically requires bottom panel removal, which may involve breaking tamper-evident seals that some manufacturers interpret as warranty-voiding actions depending on regional regulations.
  • The 32 GB maximum suggests motherboard trace routing and memory controller limitations rather than slot physical restrictions, as SO-DIMM sockets themselves can accommodate higher-capacity modules if the platform supports them.
  • DDR5-4800 modules consume approximately 1.1 volts during operation, reducing thermal output compared to DDR4 equivalents while maintaining compatibility with the laptop's power delivery subsystem.
  • Upgrading from single-rank to dual-rank modules within the supported capacity range may introduce minor latency penalties offset by increased memory bank availability for concurrent operations.