ASUS TUF Gaming FA507RR-HQ008 RAM upgrade specifications
ASUS TUF Gaming A15 FA507RR-HQ008 laptop memory upgrade specifications include DDR5-SDRAM RAM compatible with 2x SO-DIMM slots. The compatible maximum RAM capacity is 32 GB per slot configuration. Memory specifications feature DDR5-SDRAM type with 4800 MHz frequency for optimal performance. Compatible RAM upgrades support DDR5 technology standard specifications.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR5-SDRAM |
| Frequency | 4800 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.1V |
| Number of pins | 262-pin |
| Interface | PC5 |
| PC Speed Rating | PC5-4800 (PC5-38400) |
| Bandwidth | 38.4 GB/s |
| Laptop Release date | 23 September 2022 |
Additional Notes
- The ASUS TUF Gaming FA507RR-HQ008 uses DDR5 technology, which operates at higher voltages (1.25V) than DDR4 (1.2V) and requires stricter signal integrity. Replacement modules must be DDR5-certified to avoid potential instability or hardware failure, as DDR4 SO-DIMMs are physically incompatible with DDR5 slots.
- With only 2 SO-DIMM slots and a 32 GB ceiling, the upgrade path is limited to either dual 16 GB modules or single 32 GB modules if and when they become available. Asymmetrical configurations (such as one 8 GB and one 16 GB module) will force the system into single-channel mode, reducing effective bandwidth by approximately 50 percent and degrading gaming and streaming performance.
- The 4800 MHz frequency specification indicates JEDEC compliance, though the actual frequency depends on BIOS support and CPU memory controller capabilities. Third-party DDR5-5600 or DDR5-6000 modules may operate at reduced speeds due to BIOS limitations, and enabling XMP/DOCP profiles introduces warranty compliance risk with some manufacturers.
- SO-DIMM slots in gaming laptops are typically soldered into multi-layer PCBs with limited clearance above the modules. Tall heatsinks or custom thermal solutions on aftermarket RAM may contact the palmrest, keyboard assembly, or trackpad mechanism during installation, requiring disassembly verification before purchase.
- Memory upgrade in this chassis typically requires removal of the bottom panel and partial disassembly of internal components. Static discharge risk increases proportionally with disassembly scope; electrostatic wrist straps and grounded work surfaces become mandatory rather than optional to preserve the warranty's manufacturer coverage against accidental damage claims.