ASUS TUF Gaming FX506II-HN221T RAM upgrade specifications

ASUS FX506II-HN221T ASUS FX506II-HN221T ASUS FX506II-HN221T ASUS FX506II-HN221T ASUS FX506II-HN221T

ASUS TUF Gaming A15 FX506II-HN221T laptop features two SO-DIMM slots supporting DDR4-SDRAM memory upgrades. Maximum compatible RAM capacity reaches 32 GB total. Memory specifications include DDR4-3200 MHz frequency support. Upgrade slots accommodate standard SO-DIMM form factor modules. Specifications enable memory expansion for enhanced multitasking and performance in gaming and professional applications.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date08 January 2021

Additional Notes

  • The ASUS TUF Gaming FX506II-HN221T imposes a 16 GB per-slot ceiling, preventing the use of increasingly common 32 GB modules that would otherwise physically fit the SO-DIMM standard.
  • DDR4-3200 represents the baseline frequency for this configuration, though higher-rated modules will downclock to match the motherboard's supported speed without causing instability.
  • Dual-channel population requires matched module capacities across both slots to enable full bandwidth utilization, as asymmetric configurations force single-channel operation on the excess capacity.
  • The 260-pin SO-DIMM specification excludes standard desktop DIMM modules despite identical DDR4 technology, as the physical length difference prevents socket engagement.
  • Accessing both memory slots typically requires bottom panel removal, which may involve warranty seal displacement depending on regional service policies.
  • Systems shipped with soldered memory components in combination with SO-DIMM slots would reduce available upgrade capacity below the 32 GB maximum, though this model uses exclusively socketed modules.
  • Mixing different memory ranks (single-rank and dual-rank modules) can force the memory controller to operate at reduced command rates, introducing measurable latency penalties in bandwidth-sensitive workloads.
  • CAS latency specifications beyond the JEDEC standard timings for DDR4-3200 (22-22-22) provide minimal real-world benefit unless the chipset supports XMP profile loading, which requires verification in BIOS settings.
  • ECC SO-DIMM modules, while mechanically compatible, remain incompatible with consumer-grade memory controllers and will either fail POST or operate with error correction disabled.
  • Thermal considerations become relevant at maximum 32 GB configuration under sustained memory-intensive operations, as the compact chassis design limits airflow around the SO-DIMM area.