ASUS TUF Gaming FX507VV-LP366G-GAMING RAM upgrade specifications

ASUS FX507VV-LP366G-GAMING ASUS FX507VV-LP366G-GAMING ASUS FX507VV-LP366G-GAMING ASUS FX507VV-LP366G-GAMING ASUS FX507VV-LP366G-GAMING

The ASUS TUF Gaming FX507VV-LP366G-GAMING laptop features DDR5-SDRAM memory upgrade specifications with two SO-DIMM slots supporting maximum capacity of 32 GB total RAM. Memory operates at 4800 MHz frequency. Compatible DDR5 SO-DIMM modules can be installed to upgrade existing memory configuration. Specifications indicate dual-slot architecture enabling flexible memory expansion for enhanced system performance and multitasking capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency4800 MHz
Maximum RAM32 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-4800 (PC5-38400)
Bandwidth38.4 GB/s

Additional Notes

  • Dual channel architecture requires matching memory modules in both SO DIMM slots to prevent bandwidth throttling during high demand gaming or video rendering.
  • The 32 GB capacity threshold indicates a BIOS limitation that prevents the use of 32 GB high density sticks for a 64 GB total configuration.
  • The ASUS TUF Gaming FX507VV-LP366G-GAMING utilizes a motherboard chipset that does not support XMP profiles, meaning aftermarket RAM will default to JEDEC standard timings.
  • DDR5 4800 MHz modules feature on die Error Correction Code which provides enhanced system stability compared to previous generation DDR4 hardware.
  • Physical access to the memory slots requires removal of the bottom chassis cover, which necessitates a Philips head screwdriver and a non conductive prying tool to avoid static discharge or mechanical damage.
  • Voltage requirements for DDR5 are fixed at 1.1V, making standard 1.2V or 1.35V performance kits incompatible with the internal power delivery system.
  • Populating both slots reduces the electrical load per module when compared to a single stick configuration, potentially lowering localized heat buildup inside the compact laptop frame.