ASUS TUF Gaming FX507ZI4-LP031W RAM upgrade specifications
The ASUS TUF Gaming F15 FX507ZI4-LP031W features DDR4-SDRAM memory specifications with two SO-DIMM slots supporting maximum RAM capacity of 32 GB. Memory upgrade slots accommodate standard SO-DIMM form factor modules operating at 3200 MHz frequency. Compatible DDR4 specifications enable system memory expansion for enhanced performance. Maximum compatible memory capacity reaches 32 GB when both upgrade slots are populated with appropriate DDR4-SDRAM modules.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
Additional Notes
- The ASUS TUF Gaming FX507ZI4-LP031W accommodates DDR4-SDRAM exclusively, which restricts upgrades to DDR4 modules only; DDR5 memory is not compatible regardless of motherboard revision.
- Dual SO-DIMM slots impose a practical ceiling of 16 GB per module for the 32 GB maximum capacity, requiring matched pair replacement rather than incremental single-stick additions beyond the factory configuration.
- DDR4-3200 MHz specification indicates the memory controller operates within this frequency envelope; installing higher-speed DDR4 modules will downclock to 3200 MHz, eliminating any performance advantage from premium-tier memory.
- SO-DIMM form factor necessitates laptop-specific memory modules; standard desktop UDIMM memory cannot physically insert into these slots, and improper module selection results in installation failure without forcing connections.
- The 2-slot architecture creates no upgrade flexibility; both slots must be populated simultaneously to achieve maximum capacity, and single-slot configurations reduce effective bandwidth through asymmetrical channel population.
- Memory upgrade operations typically fall outside manufacturer warranty restrictions for this gaming platform, but opening the chassis for RAM installation may void coverage if thermal paste or internal components are disturbed during access.